Electron multiplier

An electron multiplier comprising:

• an insulating substrate which includes an electrical wiring pattern and in which a through-hole extending in a thickness direction is formed, wherein the electrical wiring pattern includes a first electrical wiring pattern provided on a first surface of the insulating substrate and a second electrical wiring pattern provided on a back surface of the insulating substrate;
• a micro-channel plate arranged on the insulating substrate on one side of a through-hole of the insulating substrate in the thickness direction and electrically connected to the electrical wiring pattern, wherein the first electrical wiring pattern includes a micro-channel plate connection that is formed around the through-hole of the insulating substrate on the first surface side and electrically connected to the micro-channel plate;
• a metal plate arranged on one side of the micro-channel plate in the thickness direction and electrically connected to the micro-channel plate;
• an anode arranged on the insulating substrate on the other side of a through-hole of the insulating substrate in the thickness direction and electrically connected to the electrical wiring pattern, wherein the second electrical wiring pattern is electrically connected to the anode;
• and
• a signal readout terminal provided on and fixed to the insulating substrate for reading a signal from the anode through the electrical wiring pattern, wherein
• the metal plate is formed to include the micro-channel plate when viewed in the thickness direction, and a through-hole exposing at least a portion of the micro-channel plate is formed in the metal plate,
• the insulating substrate, the micro-channel plate, the metal plate and the anode are fixed to each other to be integral,
• the second electrical wiring pattern includes a capacitor and is electrically connected to the signal readout terminal,
• the metal plate is fixed directly to the insulating substrate by a fastening member, and
• the micro-channel plate is interposed between the insulating substrate and the metal plate and fixed to the insulating substrate and the metal plate.