Semiconductor package with terminals adjacent sides and corners

A semiconductor package comprising:

• a substrate;
• a plurality of memory packages, which are arranged on the substrate and respectively comprise corners and sides connecting the corners;
• and
• a logic chip, which is arranged adjacent to the plurality of memory packages on the substrate, comprises corners and sides connecting the corners, and comprises a plurality of terminals that are electrically connected to the plurality of memory packages,
• wherein:
• the sides of the logic chip extend in different directions from directions of the sides of the plurality of memory packages,
• the plurality of terminals of the logic chip comprise data terminals, via which signals inputting/outputting logic data pass, and an address terminal via which signals designating addresses of the data pass, and
• the data terminals and the address terminal comprise at least one terminal arrangement in which the data terminals are arranged along two of the sides of the logic chip that contact each other and the address terminal is arranged at one of the corners of the logic chip that contacts the two of the sides of the logic chip
• the plurality of memory packages comprises first and second memory packages;
• data terminals arranged along a first one of the two sides of the logic chip are electrically connected to the first memory package;
• data terminals arranged along a second one of the two sides of the logic chip are electrically connected to the second memory package;
• and
• each of the first and second memory packages is electrically connected to the address terminal.