Package structure and fabrication method thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsWen-Yu Teng, Liang-Yi Hung
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Abstract
A method for fabricating a package structure is provided, including the steps of: disposing and electrically connecting a sensing chip to a substrate; forming an encapsulant on the substrate to encapsulate the sensing chip; and forming a bright layer on the encapsulant to increase the gloss of the package structure. The encapsulant includes an additive to increase the Mohs hardness of the encapsulant. Further, the encapsulant with different additives presents different colors. Therefore, the invention obtains a high-gloss, high-hardness and colorful sensor package structure.
Claims21
A method for fabricating a package structure, comprising the steps of:
- providing at least an electronic element having a sensing surface and a non-sensing surface opposite to the sensing surface;
- disposing the electronic element on a substrate and bonding the non-sensing surface of the electronic element to the substrate through an adhesive layer, and electrically connecting the electronic element and the substrate;
- forming an encapsulant on the substrate to encapsulate side surfaces and the sensing surface of the electronic element, wherein the encapsulant has a surface roughness less than 0.1 um;
- and
- forming a bright layer on the encapsulant.
A package structure, comprising:
- a substrate;
- at least an electronic element having a sensing surface and a non-sensing surface opposite to the sensing surface, wherein the electronic element is disposed on and electrically connected to the substrate, and the non-sensing surface of the electronic element is bonded to the substrate through an adhesive layer;
- an encapsulant formed on the substrate to encapsulate side surfaces and the sensing surface of the electronic element, wherein the encapsulant has a surface roughness less than 0.1 um;
- and
- a bright layer formed on the encapsulant.
Dependencies are inferred from the claim text.