Interconnect routing configurations and associated techniques
AssigneeIntel Corporation
InventorsZhiguo Qian, Kemal Aygun, Dae-Woo Kim
Life of this patent
Estimating the term…
Abstract
Embodiments of the present disclosure are directed toward interconnect routing configurations and associated techniques. In one embodiment, an apparatus includes a substrate, a first routing layer disposed on the substrate and having a first plurality of traces, and a second routing layer disposed directly adjacent to the first routing layer and having a second plurality of traces, wherein a first trace of the first plurality of traces has a width that is greater than a width of a second trace of the second plurality of traces. Other embodiments may be described and/or claimed.
Claims15
An apparatus comprising:
- a substrate;
- a first routing layer disposed on the substrate and having a first plurality of traces;
- and
- a second routing layer disposed directly adjacent to the first routing layer and having a second plurality of traces, wherein a first trace of the first plurality of traces has a width that is greater than a width of a second trace of the second plurality of traces, and a third trace of the first plurality of traces has a width that is less than a width of a fourth trace of the second plurality of traces, and the first trace and the second traces are ground traces, and the third trace is a dummy trace, and the fourth trace is a signal trace.
A package assembly comprising:
- a package substrate;
- and
- a bridge interconnect embedded in the package substrate, the bridge interconnect including:
- a substrate,
- a first routing layer disposed on the substrate and having a first plurality of traces, and
- a second routing layer disposed directly adjacent to the first routing layer and having a second plurality of traces, wherein a first trace of the first plurality of traces has a width that is greater than a width of a second trace of the second plurality of traces, and a third trace of the first plurality of traces has a width that is less than a width of a fourth trace of the second plurality of traces, and the first trace and the second traces are ground traces, and the third trace is a dummy trace, and the fourth trace is a signal trace, and the fourth trace is electrically decoupled from the third trace.
Dependencies are inferred from the claim text.