Techniques for fast resonance convergence
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorChao-Yang Yeh
Life of this patent
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Abstract
Some methods provide an electronic design file, which includes an integrated circuit (IC) component that is operably coupled to a package component. The IC component and package component collectively form a resistor inductor capacitor (RLC) resonant circuit. The method also provides a damping component in the electronic design file. This damping component is configured to reduce a pre-resonant time during which energy exchanged in the RLC resonant circuit approaches a steady-state, and thereby speeds simulation time.
Claims19
A method, comprising:
- providing an electronic design file that includes an integrated circuit (IC) component that is operably coupled to a package component, wherein the IC component and package component collectively form a resistor inductor capacitor (RLC) resonant circuit;
- providing a damping component in the electronic design file, wherein the damping component is configured to reduce a pre-resonant time during which the RLC resonant circuit approaches a resonant condition, wherein the damping component comprises a time-dependent resistance that decreases from an initial resistance to a final resistance that is less than the initial resistance, wherein the initial resistance is proportional to (L/C)1/2, and wherein L comprises a package inductance and C comprises a die capacitance;
- performing a first simulation of the RLC resonant circuit with the damping component, the first simulation being performed until the resonant condition is met;
- when the resonant condition is met, performing a second simulation to model power delivery to the IC component based on the electronic design file;
- and
- selectively manufacturing the IC component on a substrate based on results of the second simulation.
A packaged integrated circuit (IC), comprising:
- an integrated circuit (IC) component disposed on a piece of semiconductor material;
- a package component having pins that are operably coupled to the IC component, wherein the IC component and package component collectively form a resistor inductor capacitor (RLC) resonant circuit;
- and
- a damping component configured to reduce a pre-resonant time, during which energy exchanged in the RLC resonant circuit approaches a steady-state, by providing a time-dependent resistance that decreases from an initial resistance to a final resistance that is less than the initial resistance, wherein the initial resistance comprises (L/C)1/2, wherein L comprises a package inductance and C comprises a die capacitance.
A method, comprising:
- providing an electronic design file that includes an integrated circuit (IC) component that is operably coupled to a package component, wherein the IC component and package component collectively form a resistor inductor capacitor (RLC) resonant circuit;
- providing a damping component in the electronic design file, wherein the damping component is configured to reduce a pre-resonant time during which energy exchanged in the RLC resonant circuit approaches a steady-state;
- performing a simulation of the RLC resonant circuit with the damping component based on the electronic design file, the simulation being performed until a resonant condition is met;
- evaluating the resonant condition after a final resistance of the RLC resonant circuit has been reached;
- and
- when the resonant condition is met, selectively manufacturing the IC component on a substrate based on results of the simulation.
Dependencies are inferred from the claim text.