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US 9,541,836 B2Granted
Method and apparatus for baking photoresist patterns
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChin-Min Lin, De-Fang Huang, Ching-Hui Tsao
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Abstract
In accordance with some embodiments, a method and an apparatus for baking photoresist patterns are provided. The method includes putting a wafer over a heating assembly. A photoresist pattern is formed over a top surface of the wafer. The method further includes curing the wafer from the top surface of the wafer by a curing assembly while heating the wafer from a bottom surface of the wafer by a heating assembly.
Claims20
A method for baking a wafer, comprising:
- putting a wafer over a heating assembly, wherein a photoresist pattern is formed over a top surface of the wafer;
- moving down a curing assembly to be close to the top surface of the wafer by a support arm moving down a cap, wherein the cap is positioned over the heating assembly and connected to the support arm, and the curing assembly is fixed in the cap;
- and
- curing the wafer from the top surface of the wafer by the curing assembly while heating the wafer from a bottom surface of the wafer by the heating assembly.
1 more element
A method for baking a semiconductor substrate, comprising:
- putting a semiconductor substrate over a heating assembly to ensure that a bottom surface of the semiconductor substrate is close to the heating assembly;
- moving down a curing assembly to be close to a top surface of the semiconductor substrate by a support arm moving down a cap, wherein the cap is positioned over the heating assembly and connected to the support arm, and the curing assembly is fixed in the cap;
- and
- heating the bottom surface of the semiconductor substrate by the heating assembly and curing the top surface of the semiconductor substrate by the curing assembly simultaneously.
1 more element
A baking apparatus, comprising:
- a housing;
- a support base positioned in the housing;
- a cover in the housing, opposite the support base, wherein the cover comprises a support arm movably positioned on the support base, and a cap connected to the support arm;
- a heating assembly positioned on the support base, configured to heat a wafer from a bottom surface of the wafer;
- and
- a curing assembly, positioned in an accommodation space formed by the cap, wherein the curing assembly is configured to cure the wafer from a top surface of the wafer,
- wherein the curing assembly is moved down to be close to the top surface of the wafer by the support arm moving down the cap before the curing assembly cures the wafer.
4 more elements
Dependencies are inferred from the claim text.