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US 9,541,831 B2Granted
Positive resist composition and method of pattern formation with the same
AssigneeFUJIFILM Corporation
InventorsHiromi Kanda, Shinichi Kanna, Haruki Inabe
Life of this patent
Estimating the term…
Abstract
A positive resist composition comprising: (A) a resin which comes to have an enhanced solubility in an alkaline developing solution by an action of an acid; (B) a compound which generates an acid upon irradiation with actinic rays or a radiation; (C) a fluorine-containing compound containing at least one group selected from the groups (x) to (z); and (F) a solvent, and a method of pattern formation with the composition: (x) an alkali-soluble group; (y) a group which decomposes by an action of an alkaline developing solution to enhance a solubility in an alkaline developing solution; and (z) a group which decomposes by an action of an acid.
Claims17
A positive resist composition comprising:
- (A) a resin which comes to have an enhanced solubility in an alkaline developing solution by an action of an acid;
- (B) a compound which generates an acid upon irradiation with actinic rays or a radiation;
- (C) a fluorine-containing compound containing at least one group selected from the groups (x) to (z):
- (x) an alkali-soluble group;
- (y) a group which decomposes by an action of an alkaline developing solution to enhance a solubility in an alkaline developing solution;
- and
- (z) a group which decomposes by an action of an acid, and
- (F) a solvent,
- wherein the fluorine-containing compound (C) has an alcoholic hydroxyl group, and an alcohol moiety for the alcoholic hydroxyl group is a fluorinated alcohol,
- the fluorine-containing compound (C) is an alkali-soluble compound containing an alkyl group having a fluorine atom and 1 to 4 carbon atoms, a cycloalkyl group having a fluorine atom or an aryl group having a fluorine atom,
- the fluorine-containing compound (C) has a molecular weight of from 1,000 to 100,000,
- the amount of the fluorine-containing compound (C) is from 0.1 to 10% by mass with respect to the total solid components in the positive resist composition, and
- the total solids concentration in the positive resist composition is from 1.0 to 6.0% by mass.
10 more elements
A resist film comprising a positive resist composition including:
- (A) a resin which comes to have an enhanced solubility in an alkaline developing solution by an action of an acid;
- (B) a compound which generates an acid upon irradiation with actinic rays or a radiation;
- and
- (C) a fluorine-containing compound containing at least one group selected from the groups (x) to (z):
- (x) an alkali-soluble group;
- (y) a group which decomposes by an action of an alkaline developing solution to enhance a solubility in an alkaline developing solution;
- and
- (z) a group which decomposes by an action of an acid,
- wherein the fluorine-containing compound (C) has an alcoholic hydroxyl group, and an alcohol moiety for the alcoholic hydroxyl group is a fluorinated alcohol,
- the fluorine-containing compound (C) is an alkali-soluble compound containing an alkyl group having a fluorine atom and 1 to 4 carbon atoms, a cycloalkyl group having a fluorine atom or an aryl group having a fluorine atom,
- the fluorine-containing compound (C) has a molecular weight of from 1,000 to 100,000,
- the amount of the fluorine-containing compound (C) is from 0.1 to 10% by mass with respect to the total solid components in the positive resist composition, and
- the total solids concentration in the positive resist composition is from 1.0 to 6.0% by mass.
10 more elements
A method for filtrating a positive resist composition, comprising:
- filtrating the composition using a filter,
- wherein the positive resist composition contains:
- (A) a resin which comes to have an enhanced solubility in an alkaline developing solution by an action of an acid;
- (B) a compound which generates an acid upon irradiation with actinic rays or a radiation;
- (C) a fluorine-containing compound containing at least one group selected from the groups (x) to (z):
- (x) an alkali-soluble group;
- (y) a group which decomposes by an action of an alkaline developing solution to enhance a solubility in an alkaline developing solution;
- and
- (z) a group which decomposes by an action of an acid, and
- (F) a solvent,
- wherein the fluorine-containing compound (C) has an alcoholic hydroxyl group, and an alcohol moiety for the alcoholic hydroxyl group is a fluorinated alcohol,
- the fluorine-containing compound (C) is an alkali-soluble compound containing an alkyl group having a fluorine atom and 1 to 4 carbon atoms, a cycloalkyl group having a fluorine atom or an aryl group having a fluorine atom,
- the fluorine-containing compound (C) has a molecular weight of from 1,000 to 100,000,
- the amount of the fluorine-containing compound (C) is from 0.1 to 10% by mass with respect to the total solid components in the positive resist composition, and
- the total solids concentration in the positive resist composition is from 1.0 to 6.0% by mass.
12 more elements
A positive resist composition comprising:
- (A) a resin which comes to have an enhanced solubility in an alkaline developing solution by an action of an acid;
- (B) a compound which generates an acid upon irradiation with actinic rays or a radiation;
- (C) a fluorine-containing compound containing at least one group selected from the groups (x) to (z):
- (x) an alkali-soluble group;
- (y) a group which decomposes by an action of an alkaline developing solution to enhance a solubility in an alkaline developing solution;
- and
- (z) a group which decomposes by an action of an acid, and
- (F) a solvent,
- wherein the fluorine-containing compound (C) has a structure represented by formula (F3):
- wherein R62 and R63 each independently represents a fluoroalkyl group, provided that R62 and R63 may be bonded to each other to form a ring;
- and R64 represents a hydrogen atom, a fluorine atom or an alkyl group,
- the fluorine-containing compound (C) has a molecular weight of from 1,000 to 100,000,
- the amount of the fluorine-containing compound (C) is from 0.1 to 10% by mass with respect to the total solid components in the positive resist composition, and
- the total solids concentration in the positive resist composition is from 1.0 to 6.0% by mass.
11 more elements
Dependencies are inferred from the claim text.