Method and system for fast inspecting defects
AssigneeHermes Microvision, Inc.
InventorsWei Fang, Jack Jau
Life of this patent
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Abstract
A method and system for inspecting defects saves scanned raw data as an original image so as to save time for repeated scanning and achieve faster defect inspection and lower false rate by reviewing suspicious defects and other regions of interest in the original image by using the same or different image-processing algorithm with the same or different parameters.
Claims12
A method for fast inspecting defects by using an e beam tool, comprising:
- scanning a surface of a wafer to generate a scanned raw data;
- identifying suspicious defects or critical patterns in said scanned raw data by using a first image-processing algorithm with a first set of parameters;
- saving scanned raw data from the scanning step as an original image;
- identifying hot spots in said original image according to the suspicious defects or the critical patterns;
- marking locations of the hot spots in said original image;
- and
- reviewing the locations on the original image to identify defects on the surface using said first image-processing algorithm with a second set of parameters different from the first set of parameters;
- reviewing the locations on the original image to identify defects on the surface using a second image-processing algorithm.
A non-transitory computer readable medium encoded with a computer program implementing a method for fast inspecting defects by using an e beam tool, wherein the method comprises steps of:
- scanning a surface of a wafer to generate a scanned raw data;
- identifying suspicious defects or critical patterns in said scanned raw data by using a first image-processing algorithm with a first set of parameters;
- saving scanned raw data from the scanning step as an original image;
- identifying hot spots in said original image according to the suspicious defects or the critical patterns;
- marking locations of the hot spots in said original image;
- and
- reviewing the locations on the original image to identify defects on the surface using said first image-processing algorithm with a second set of parameters different from the first set of parameters;
- reviewing the locations on the original image to identify defects on the surface using a second image-processing algorithm.
Dependencies are inferred from the claim text.