Integrated circuit device packages including optical elements
AssigneeSamsung Electronics Co., Ltd.
InventorsHo-Chul Ji, Seung-Hyuk Chang
Life of this patent
Estimating the term…
Abstract
Integrated circuit device packages including optical elements are provided. The integrated circuit device package may include an integrated circuit device and a conductive pad on a first surface of the integrated circuit device. The conductive pad may be electrically connected to the integrated circuit device and may be configured to transmit an electrical signal. The integrated circuit device package may also include an optical element in the integrated circuit device and the optical element may be configured to transmit an optical signal through a second surface of the integrated circuit device that is opposite the first surface of the integrated circuit device.
Claims18
An optical package, comprising:
- a semiconductor chip, the semiconductor chip comprising a first surface on which a pad configured to transmit an electrical signal is arranged and a second surface opposite the first surface;
- a conductive bump electrically connected to the pad and protruding away from the first surface of the semiconductor chip;
- an optical element in the semiconductor chip configured to input and/or output an optical signal through the second surface of the semiconductor chip;
- a molding member extending on sides and the second surface of the semiconductor chip, wherein the molding member comprises a window that exposes a portion of the second surface of the semiconductor chip and overlaps the optical element when viewed from a plan perspective;
- and
- an optical fiber module configured to transmit an optical signal to the optical element through the second surface of the semiconductor chip, a portion of the optical fiber module being inserted in the window of the molding member,
- wherein the semiconductor chip further comprises a reflective layer on the first surface that is configured to reflect an optical signal toward the optical element, and
- wherein the optical element is between the optical fiber module and the reflective layer.
An optical package, comprising:
- a semiconductor chip, the semiconductor chip comprising a first surface on which a pad configured to transmit an electrical signal is arranged and a second surface opposite the first surface;
- a conductive bump electrically connected to the pad and protruding away from the first surface of the semiconductor chip;
- an optical element in the semiconductor chip configured to input and/or output an optical signal through the second surface of the semiconductor chip;
- a molding member extending on sides and the second surface of the semiconductor chip, wherein the molding member comprises a window that exposes a portion of the second surface of the semiconductor chip and overlaps the optical element when viewed from a plan perspective;
- and
- an optical fiber module configured to transmit an optical signal to the optical element through the second surface of the semiconductor chip, a portion of the optical fiber module being inserted in the window of the molding member,
- wherein the portion of the second surface of the semiconductor chip exposed by the window of the molding member comprises a fixing groove, and
- wherein the optical fiber module is detachably fixed in the fixing groove in the second surface of the semiconductor chip.
Dependencies are inferred from the claim text.