Current application device and manufacturing method of semiconductor element

A current application device, comprising:

• a contacting section which includes a plurality of projections for contacting a contact region within an active region of a semiconductor element and for applying a test current thereto, in which the plurality of projections consist of inner side projections for contacting an inner side contact region of the active region and outer side projections for contacting an outer side contact region of the active region surrounding the inner side contact region, the outer side projections surrounding the inner side projections, and an arrangement density of the outer side projections is greater than an arrangement density of the inner side projections;
• and
• a pressing section which presses the contacting section against the semiconductor element such that the plurality of the projections contact the contact region,
• wherein the plurality of the projections are arranged in a rectangular region, and
• an arrangement area of each of the outer side projections disposed at an outer peripheral portion of the region is larger than an arrangement area of each of the inner side projections disposed at an inner portion of the region, and also the arrangement area of the outer side projections at a corner portion of the region is larger than the arrangement area of the outer side projections at portions other than the corner portion of the region.

A manufacturing method of a semiconductor, comprising:

• a forming step in which the semiconductor element is formed;
• a current application step in which a test current is applied to the semiconductor element formed in the forming step, using a current application device configured to have a contacting section which includes a plurality of projections for contacting a contact region within an active region of the semiconductor element and for applying a test current thereto, in which the plurality of projections consist of inner side projections for contacting an inner side contact region of the active region and outer side projections for contacting an outer side contact region of the active region surrounding the inner side region, the outer side projections surrounding the inner side projections, the plurality of the projections are arranged such that an arrangement density of the outer side projections is greater than an arrangement density of the inner side projections, an arrangement area of each of the outer side projections is larger than an arrangement area of each of the inner side projections, and a pressing section which presses the contacting section against the semiconductor element such that the plurality of the projections contact the contact region;
• and
• a determination step of determining whether or not the semiconductor element applied with the test current in the current application step satisfies a predetermined performance, based on the test current.