Heat dissipation structure of SMD LED
OwnerWen-Sung Huinventor
Life of this patent
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Abstract
A heat dissipation structure of an SMD LED includes a substrate, an SMD LED and at least one engaging member. A plurality of conductive copper foils is covered on an upper end face of the substrate. Two electrodes are provided on a lower surface of the SMD LED and are respectively connected to two copper foils on the upper end face. An engaging hole extends through one of the copper foils adjacent the SMD LED and through the substrate. The engaging member is made of high thermal conductive metal and is engaged in the engaging hole to combine the copper foil and the substrate. Accordingly, heat generated by the SMD LED can be directly transferred to an exposed lower end face of the substrate through the engaging member for more heat dissipation and less luminance decrease of the SMD LED.
Claims17
A heat dissipation structure of a surface mount device light emitting diode (SMD LED), comprising:
- a fiber-based substrate including upper and lower end faces, with a plurality of spaced copper foils provided on the upper end face, with the lower end face provided with a metal sheet hung under or horizontally mounted below the lower end face;
- at least one SMD LED including a lower surface provided with two electrodes, with the two electrodes including an anode and a cathode and respectively connecting to two copper foils of the plurality of copper foils on the upper end face to form a conductive path;
- at least one engaging hole extending through one of the plurality of copper foils on the upper end face and through the upper and lower end faces of the fiber-based substrate, with the at least one engaging hole internally covered with a thermal conductive metal layer;
- and
- at least one engaging member made of thermal conductive metal and engaged in the at least one engaging hole, with the at least one engaging member including an upper end engaged with the one of the plurality of copper foils on the upper end face through which the at least one engaging hole extends, with the at least one engaging member further including a lower end engaged with both the at least one copper foil and the metal sheet on the lower end face of the fiber-based substrate, with the metal sheet including opposite first and second surfaces, with the metal sheet being thermally insulated from the lower end face with at least one of the first and second surfaces exposed to ambient environment, and wherein a space is defined by the first surface of the metal sheet and the lower end face, with the first surface in the space and the second surface exposed to the ambient environment.
A heat dissipation structure of a surface mount device light emitting diode (SMD LED) comprising:
- a substrate including upper and lower end faces, with a plurality of spaced copper foils provided on the upper end face, with the lower end face provided with a metal piece;
- at least one SMD LED including a lower surface provided with two electrodes, with the two electrodes including an anode and a cathode and respectively connecting to two copper foils of the plurality of copper foils on the upper end face to form a conductive path;
- an engaging hole extending through one of the plurality of copper foils on the upper end face and through the upper and lower end faces of the substrate;
- and
- an engaging member made of thermal conductive metal and engaged in the engaging hole, with the engaging member including an upper end engaged with the copper foil on the upper end face through which the engaging hole extends, with the engaging member further including a lower end, with the metal piece including opposite first and second surfaces, with the metal piece being thermally insulated from the lower end face with at least one of the first and second surfaces exposed to ambient environment wherein the metal piece comprises a metal sheet, wherein a space is defined by the first surface of the metal sheet and the lower end face, with the first surface in the space and the second surface exposed to the ambient environment, and wherein the lower end of the engaging member engages with the metal piece.
Dependencies are inferred from the claim text.