Adhesive composition and adhesive tape
Assignee3M Innovative Properties Company
InventorsQing Wu, Zhou Li, Liang Qin, Fanwang Kong, Hongmei Wan
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Abstract
The present invention provides a thermally conductive adhesive composition, based on the total weight of the composition, comprising: (a) 5-70% by weight of an epoxy component; (b) 5-60% by weight of thermally conductive material; (c) 0.001-10% by weight of a photoinitiator; (d) 0-40% by weight of a thermoplastic polymer; (e) 0-50% by weight of a hydroxyl-functional component; and (f) 0-50% by weight of a halogen-free flame retardant. The present invention further provides a thermally conductive adhesive tape comprising the adhesive composition.
Claims12
A thermally conductive adhesive composition, based on the total weight of the composition, comprising:
- (a) 15-45% by weight of an epoxy component;
- (b) 20-40% by weight of electrically insulating, thermally conductive material;
- (c) 0.5-4% by weight of a photoinitiator;
- (d) 5-25% by weight of a thermoplastic polymer;
- (e) 1-5% by weight of a hydroxyl-functional component;
- and
- (f) 1-25% by weight of a halogen-free flame retardant.
Dependencies are inferred from the claim text.