Anisotropic conductive film and semiconductor device bonded by the same

A display device bonded by a rapid low-temperature curable anisotropic conductive film, the rapid low-temperature curable anisotropic conductive film comprising:

• about 1 to about 20 parts by weight of a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq,
• about 5 to about 50 parts by weight of a hydrogenated epoxy resin;
• about 5 to about 50 parts by weight of a sulfonium cation thermal curing catalyst;
• about 20 to about 60 parts by weight of a binder resin;
• and
• about 0.1 to about 30 parts by weight of conductive particles, all parts by weight being based on 100 parts by weight of the rapid low-temperature curable anisotropic conductive film in terms of solid content,
• wherein the rapid low-temperature curable anisotropic conductive film has a curing rate of about 80% or more when cured at 150 to 170° C. for 5 seconds.

A display device bonded by an anisotropic conductive film, the anisotropic conductive film comprising:

• about 1 to about 20 parts by weight of a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq;
• about 5 to about 50 parts by weight of a hydrogenated bisphenol A epoxy resin;
• and
• about 0.1 to about 10 parts by weight of a sulfonium cation curing catalyst, all parts by weight being based on 100 parts by weight of the anisotropic conductive film in terms of solid content,
• wherein the anisotropic conductive film has a curing rate of about 80% or more when cured at 150 to 170° C. for 5 seconds.