Composition for forming adhesive layer of dicing film, and dicing film

A composition for forming an adhesive layer of a dicing film, comprising:

• a silicon compound oil;
• an adhesive binder;
• and a photoinitiator,
• wherein a weight ratio of the silicon compound oil to the adhesive binder is 0.01% to 4.5%,
• wherein the silicon compound oil comprises at least one silicon compound selected from the group consisting of a silicon compound of the following Chemical Formula 1, a silicon compound of the following Chemical Formula 2, and a polyether modified hydroxy functional polydimethylsiloxane;
• and an organic solvent:
• wherein, in Chemical Formula 1, R1 is independently an alkyl group having a carbon number of 1 to 3, R2 is a hydroxyl group, an alkylene alcohol having a carbon number of 1 to 10, an epoxy group, an amino group, a thiol group, or a carboxyl group, m is an integer of 0 to 500, and n is an integer of 1 to 500,
• wherein, in Chemical Formula 2, R1 is independently an alkyl group having a carbon number of 1 to 3,
• at least one of R3 and R4 is an alkyl group having a carbon number of 1 to 3, and the other is an alkylene alcohol having a carbon number of 1 to 10, an epoxy group, an amino group, a thiol group, or a carboxyl group, or R3 and R4 are independently a hydroxyl group, an alkylene alcohol having a carbon number of 1 to 10, an epoxy group, an amino group, a thiol group, or a carboxyl group, and p is an integer of 0 to 500.