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US 9,540,529 B2Granted
Solder mask compositions for aerosol jet printing
AssigneeXerox Corporation
InventorsYiliang Wu, Kurt Halfyard
Life of this patent
Estimating the term…
Abstract
A solder mask ink for aerosol jet printing includes a metal oxide and a propylene glycol-based solvent; the solder mask ink has a viscosity from about 50 cps to about 1,000 cps at shear rate of 10 1/s at 25° C., and a shear thinning index from about 1.0 to about 2.0.
Claims11
A solder mask ink comprising:
- i) a resin or UV curable monomer;
- ii) an inorganic pigment;
- and
- iii) from about 20 to about 50 percent by total weight of the ink of solvent, wherein the solvent is a 1:1 combination of solvents propylene glycol monomethyl ether acetate and dipropylene glycol monomethyl ether acetate;
- wherein the solder mask ink formulation has a viscosity from about 50 cps about 800 cps at shear rate of 10 1/s at 25° C., and a shearing thinning index from about 1.0 to about 1.5.
2 more elements
A method comprising:
- aerosol jet printing a solder mask ink in a pattern on a substrate, the solder mask ink comprising:
- i) a resin or UV curable monomer;
- ii) an inorganic pigment;
- and
- iii) about 20 to about 50 percent by weight of an ether or an ester solvent based on propylene glycol;
- wherein the solder mask ink has a viscosity from about 50 cps to about 800 cps at shear rate of 10 1/s at 25° C., and a shearing thinning index from about 1 to about 1.5;
- and
- curing the jetted solder.
5 more elements
Dependencies are inferred from the claim text.