Light-curing thermoplastic epoxy resin adhesive

A polymerizable composition for processing optical components consisting of:

• an amount of a cycloaliphatic diepoxide and a cycloaliphatic monoepoxide wherein the molar ratio of the cycloaliphatic diepoxide compound to the cycloaliphatic monoepoxide compound is 1:1 to 10:1;
• an amount of a monovalent alcohol having the following structure:
• R—(CH2)n—OH where n is 1 to 6, R is chosen from the group consisting of alkyl, aryl, alkoxy, and a cycloalkyl;
• a photopolymerization initiator;
• and
• a resin component chosen from the group consisting of a natural resin, a synthetic resin, and mixtures thereof, wherein the polymerizable composition forms an adhesive thermoplastic oligomer or polymer and the resin component is capable of softening the adhesive thermoplastic oligomer or polymer after polymerization;
• and optionally
• a filler;
• a highly disperse silicic acid as a consistency regulator;
• a dye;
• a solid plasticizer;
• and
• wherein the ratio of the total moles of epoxide groups provided by the amount of the cycloaliphatic diepoxide and cycloaliphatic monoepoxide compounds to the total moles of hydroxyl groups provided by the amount of the monovalent alcohol is from 0.9:1.0 to 4.0:1.0;
• and
• the hydroxyl functionality of all organic compounds of the polymerizable composition having OH group(s) is in the range of from 1.0 to 1.25.