Porous silicon
AssigneepSiMedica Limited
InventorsLeigh Trevor Canham, Armando Loni
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Abstract
A method of making porous silicon using a chemical etchant comprising metal ions is described.
Drawings
Claims15
A method of making porous silicon possessing a porosity of about 50 to about 70 vol % comprising contacting elemental particulate silicon with an aqueous chemical etchant, wherein the chemical etchant comprises hydrofluoric acid and a dissolved metal salt and wherein the method comprises cooling the chemical etchant to about −25° C. to about −15° C. before it is contacted with the elemental particulate silicon.
A method of making porous silicon comprising contacting elemental particulate silicon with an aqueous chemical etchant, wherein the chemical etchant comprises hydrofluoric acid and a dissolved metal salt and wherein the method comprises cooling the chemical etchant to about −25° C. to about −15° C. before it is contacted with the elemental particulate silicon and wherein the d90 of the elemental particulate silicon is about 11 μm or less.
A method of making porous silicon, wherein the porous silicon possesses a porosity of about 50 to about 70 vol %, comprising contacting elemental particulate silicon with an aqueous chemical etchant, wherein the chemical etchant comprises hydrofluoric acid and a dissolved metal salt and wherein the method comprises cooling the chemical etchant to about −25° C. to about −15° C. before it is contacted with the elemental particulate silicon and wherein the d90 of the elemental particulate silicon is between about 5 μm and about 11 μm or less.
Dependencies are inferred from the claim text.