Methods for CMOS-MEMS integrated devices with multiple sealed cavities maintained at various pressures

A Microelectromechanical Systems (MEMS) device comprising:

• a MEMS substrate with cavities bonded to a second substrate, forming a plurality of sealed enclosures, wherein each of the plurality of sealed enclosures is defined by the MEMS substrate, the second substrate, and a seal-ring material, wherein one of the plurality of sealed enclosures includes an inertial sensor;
• wherein at least one of plurality of sealed enclosures further includes a non gettering out-gassing substance to desorb one or more gases to increase cavity pressure in the at least one of the plurality of sealed enclosures and at least one other of the plurality of sealed enclosures does not include the non gettering out-gassing substance;
• wherein the at least one sealed enclosure with the non gettering out-gassing substance has a higher cavity pressure than the at least one other of the plurality of sealed enclosures without the non gettering out-gassing substance.