Packaged sensor assembly
AssigneeSTMicroelectronics S.r.l.
InventorsGiuseppe Bruno, Sebastiano Conti, Mario Chiricosta, Michele Vaiana, Calogero Marco Ippolito, Mario Maiore, Daniele Casella
Life of this patent
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Abstract
A packaged sensor assembly includes: a packaging structure, having at least one opening; a humidity sensor and a pressure sensor, which are housed inside the packaging structure and communicate fluidically with the outside through the opening, and a control circuit, operatively coupled to the humidity sensor and to the pressure sensor; wherein the humidity sensor and the control circuit are integrated in a first chip, and the pressure sensor is integrated in a second chip distinct from the first chip and bonded to the first chip.
Claims23
A packaged sensor assembly comprising:
- a packaging structure having an opening;
- a first semiconductor chip that integrates a humidity sensor and a control circuit operatively coupled to the humidity sensor, the humidity sensor housed inside the packaging structure and in fluid communication with an environment external to the sensor assembly through the opening;
- and
- a second semiconductor chip that integrates a MEMS pressure sensor bonded to the first semiconductor chip, the pressure sensor operatively coupled to the control circuit, the pressure sensor housed inside the packaging structure and in fluid communication with the environment external to the sensor assembly through the opening.
An electronic system comprising:
- a control unit;
- and
- a sensor assembly operative coupled to the control unit, the sensor assembly including:
- a packaging body having a through opening that places an area internal to the packaging body in fluid communication with an environment external to the sensor assembly;
- a first semiconductor chip that integrates a humidity sensor and a control circuit operatively coupled to the humidity sensor, the humidity sensor housed in the internal area to the packaging body and in fluid communication with the environment external to the sensor assembly through the opening;
- and
- a second semiconductor chip that integrates a MEMS pressure sensor bonded to the first semiconductor chip, the pressure sensor housed inside the packaging body and in fluid communication with the environment external the sensor assembly through the opening, the pressure sensor operatively coupled to the control circuit.
A sensor assembly comprising:
- a packaging structure including a substrate, a cap, and molding material, the packaging structure including a through opening;
- a first semiconductor chip that integrates a humidity sensor and a control circuit, the control circuit being operatively coupled to the humidity sensor, the humidity sensor housed within the packaging structure such that the humidity sensor is in fluid communication with an environment external through the opening;
- and
- a second semiconductor chip coupled to the first semiconductor chip, the second semiconductor chip integrating a pressure sensor that is operatively coupled to control circuit, the pressure sensor housed inside the packaging structure and in fluid communication with the environment external to the sensor assembly through the opening.
Dependencies are inferred from the claim text.