MEMS-CMOS device that minimizes outgassing and methods of manufacture
AssigneeInvenSense, Inc.
InventorsPeter Smeys, Jong Il Shin, Jongwoo Shin
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Abstract
A MEMS device is disclosed. The MEMS device includes a first substrate. At least one structure is formed within the first substrate. The first substrate includes at least one first conductive pad thereon. The MEMS device also includes a second substrate. The second substrate includes a passivation layer. The passivation layer includes a plurality of layers. A top layer of the plurality of layers comprises an outgassing barrier layer. At least one second conductive pad and at least one electrode are coupled to the top layer. At least one first conductive pad is coupled to the at least one second conductive pad.
Claims12
A MEMS device comprising:
- a first substrate having at least one structure formed within the first substrate and comprising at least one first conductive pad on the first substrate;
- and
- a second substrate having a passivation layer, wherein the passivation layer comprises a plurality of layers, wherein a top layer of the plurality of layers comprises an outgassing barrier layer, wherein at least one second conductive pad and at least one electrode are coupled to the top layer, wherein the at least one first conductive pad is coupled to the at least one second conductive pad, and wherein the first substrate comprises a MEMS substrate and the second substrate comprises a CMOS substrate.
Dependencies are inferred from the claim text.