Debonders with a recess and a side wall opening for semiconductor fabrication

A debonding system comprising:

• a debonding chuck including a first surface that defines a recess configured to hold a wafer of an assembly that includes the wafer bonded to a plate having a first diameter that is larger than a second diameter of the wafer, the assembly configured such that the plate includes a peripheral area not covered by the wafer, and such that when the wafer of the assembly is placed within the recess, at least a portion of the peripheral area of the plate engages at least a portion of the first surface, a second surface disposed in the recess and separated from the first surface, the second surface including a plurality of suction openings configured to deliver suction to the recess and an angled surface formed along a portion of a perimeter of the second surface, and a third surface substantially connecting the first and the second surfaces;
• and
• a pressure sensor configured to monitor a pressure associated with the suction during the delivery of the suction to the recess.