Substrate bonding apparatus, substrate holding apparatus, substrate bonding method, substrate holding method, multilayered semiconductor device, and multilayered substrate

A substrate bonding apparatus comprising:

• a controller configured to calculate an amount of misalignment between two substrates that are to be stacked on each other;
• a deformer operable to deform at least a first substrate of the two substrates in accordance with the calculated amount of misalignment between the two substrates;
• a holder that holds the first substrate in a state where the misalignment is correct through deformation by the deformer;
• a transporter that transports the holder holding the first substrate in a state where the misalignment is corrected from a position at which the first substrate is held by the holder;
• and
• a bonder operable to bond the first substrate that has been transported by the transporter to the second substrate.

A substrate holding apparatus comprising:

• a controller configured to calculate an amount of misalignment between two substrates that are to be stacked on each other;
• a holder that holds a first substrate of the two substrates to be bonded to a second substrate of the two substrates;
• and
• a deformer that deforms the first substrate while being held by the holder by bending the first substrate in order to correct the calculated amount of misalignment between the first substrate and the second substrate.

A substrate holding apparatus comprising:

• a controller configured to calculate an amount of misalignment between two substrates that are to be stacked on each other;
• a holder operable to hold a first substrate of the two substrates to be bonded to a second substrate of the two substrates;
• and
• a deformer operable to deform the first substrate by bending the first substrate in order to correct the obtained amount of misalignment between the first substrate and the second substrate.