Polishing method

A polishing method comprising:

• polishing a substrate by pressing the substrate against a polishing pad on a polishing table by a polishing head while moving the polishing table and the polishing head relative to each other;
• moving the polishing head, holding the substrate, to a predetermined position above a substrate transfer device;
• cleaning the substrate by ejecting a cleaning fluid onto the substrate held by the polishing head located at the predetermined position;
• during cleaning of the substrate, ejecting a fluid toward a release nozzle located at the substrate transfer device;
• and
• after cleaning of the substrate, releasing the substrate from the polishing head by ejecting a releasing shower from the release nozzle into a gap between the polishing head and the substrate.

A polishing method comprising:

• polishing a substrate by pressing the substrate against a polishing pad on a polishing table by a polishing head while moving the polishing table and the polishing head relative to each other;
• moving the polishing head, holding the substrate, to a predetermined position above a substrate transfer device;
• moving a shutter to a position above a release nozzle to cover the release nozzle which is located at the substrate transfer device;
• cleaning the substrate by ejecting a cleaning fluid onto the substrate held by the polishing head located at the predetermined position, while the shutter is covering the release nozzle;
• after cleaning of the substrate, moving the shutter to a retreat position away from the release nozzle;
• and then
• releasing the substrate from the polishing head by ejecting a releasing shower from the release nozzle into a gap between the polishing head and the substrate.

A polishing method comprising:

• polishing a substrate by pressing the substrate against a polishing pad on a polishing table by a polishing head while moving the polishing table and the polishing head relative to each other;
• moving the polishing head, holding the substrate, to a predetermined position above a substrate transfer device;
• moving a release nozzle, which is located at the substrate transfer device, to a retreat position away from the substrate transfer device;
• cleaning the substrate by ejecting a cleaning fluid onto the substrate held by the polishing head located at the predetermined position, while the release nozzle is located at the retreat position;
• after cleaning of the substrate, moving the release nozzle from the retreat position to a shower position;
• and then
• releasing the substrate from the polishing head by ejecting a releasing shower from the release nozzle into a gap between the polishing head and the substrate.