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US 9,539,621 B2Granted
Wafer cleaning device and method thereof
AssigneeUnited Microelectronics Corp.
InventorsHsin-Ting Tsai, Cheng-Hung Yu, Chin-Kuang Liu, Ming-Hsin Lee, Wei-Hong Chuang, Kuei-Chang Tung, Yan-Yi Lu, Chin-Chin Wang
Life of this patent
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Abstract
A wafer cleaning device comprising a wafer stage for holding a wafer having a surface to be washed, a first nozzle positioned above the wafer, a second nozzle positioned above the wafer. A first height is between the first nozzle and the surface and a second height is between the second nozzle and the surface, wherein the first height is shorter than the second height.
Claims12
A wafer cleaning device, comprising:
- a stage for holding a wafer having a surface;
- and
- a nozzle positioned above the wafer, and the nozzle comprising a plurality of openings, wherein heights are distances between the surface and each of the openings, the heights between the surface and each of the openings are different along with the relative location of each of the openings to the surface, and the surface is selected from a front side of the wafer and a backside of the wafer.
A wafer cleaning method, comprising:
- providing a wafer having a surface and a nozzle comprising a plurality of openings above the wafer, wherein heights are distances between the surface and each of the openings, the heights between the surface and each of the openings are different along with the relative location of each of the openings to the surface, the surface is selected from a front side of the wafer and a backside of the wafer;
- and
- rotating the wafer and spraying a cleaning solution from each of the openings to clean the surface, wherein each of the openings has a spraying parameter individually, and the spraying parameter is a function of the relative location of each of the openings to the surface.
Dependencies are inferred from the claim text.