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US 9,538,909 B2Granted
Self-illuminating CMOS imaging package
AssigneeOmniVision Technologies, Inc.
InventorsJunzhao Lei, Guannho G. Tsau
Life of this patent
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Abstract
A microelectronics chip contains an integrated CMOS imaging sensor integrated with a LED die. Circuitry is established on the chip for a shared power arrangement.
Claims19
In a microelectronics chip bearing a complementary metal oxide semiconductor (CMOS) image sensor, the improvement comprising:
- a Gallium-Arsenide (GaAs)-based substrate including (i) a first portion that is a component of the CMOS image sensor, and (ii) a second portion that is a component of a light emitting diode (LED), at least one of (a) the first portion being implanted with a first element and (b) the second portion being implanted with a second element different from the first element.
A self-illuminating CMOS imaging package comprising:
- a complementary metal oxide semiconductor (CMOS) chip including a CMOS image sensor for detecting light incident thereon from above;
- a die including a light-emitting diode (LED) configured to emit illumination propagating above and away from the image sensor;
- and
- a monolithic optical lens, optically coupled with the LED and the CMOS image sensor, and including:
- (i) a first lens portion directly above the LED, for projecting the illumination;
- and (ii) a second lens portion directly above the CMOS image sensor, for imaging light onto the CMOS image sensor, the second lens portion having at least one optical property differing from a corresponding optical property of the first lens portion.
3 more elements
Dependencies are inferred from the claim text.