Radial blower
Assigneeebm-papst Mulfingen GmbH & Co. KG
InventorsPeter Riegler, Jörg Günther, Thomas Heli, Walter Hofmann
Life of this patent
Estimating the term…
Abstract
A blower (1) with a blower housing (2), a blower wheel (4) positioned so as to rotate inside a blower housing (2), an electric motor (6) for the rotational drive of the blower wheel (4), as well as with a saucer-shaped attachment housing (8) positioned externally on the blower housing (2). The attachment housing (8) contains motor-control electronics (10) and exhibits in its connection area facing the blower housing (2) a metallic cover element (14) covering the motor control electronics (10) and protects against an electromagnetic radiation from the electric motor (6).
Claims16
A blower (1) comprising a blower housing (2), a blower wheel (4) positioned so as to rotate inside the blower housing (2), an electric motor (6) for the rotational drive of the blower wheel (4), a cupped-shaped attachment housing (8) positioned externally on the blower housing (2),
- wherein the blower is a radial blower, wherein the blower wheel (4) is constructed as a radial blower wheel and the blower housing (2) is a spiral housing with a circumferential wall (34) enclosing the blower wheel (4), at least one axial inlet opening (36), and a tangential outlet opening (38),
- wherein the attachment housing (8) contains motor-control electronics (10), the attachment housing (8) having, in a connection area facing the blower housing (2), a metallic cover element (14) which covers the motor control electronics (10) and protects the motor control electronics against electromagnetic radiation from the electric motor (6), wherein the cover element exhibits a ground connection, and
- wherein the cover element (14) is constructed as a semiconductor-cooling element, wherein the cover element (14) forms at least one form-stamped contact area (28) sized and positioned for two-dimensional heat-conducting contact to a semiconductor component part (30) of the control electronics (10), wherein a heat-conducting layer (32) is positioned between the contact area (28) of the cover element (14) and the semiconductor component part (30), and wherein the cover element exhibits two such contact areas (28).
Dependencies are inferred from the claim text.