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US 9,533,371 B2Granted
Apparatus and method for on line surface enhancement of a workpiece
AssigneeUnited Technologies Corporation
InventorsTahany Ibrahim El-Wardany, Daniel V. Viens, Robert A. Grelotti, Joseph J. Sangiovanni, John F. Zimmerman, Yan Zhang
Life of this patent
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Abstract
An apparatus to cut and surface process a workpiece includes a cutting tool to cut the workpiece; a peening tool to peen surfaces of the cut workpiece; and a controller to control the cutting tool, the peening tool and the workpiece to move simultaneously.
Claims1
A method of surface processing and machining a workpiece with an apparatus comprising a cutting tool, a peening tool and a controller, the method comprising:
- cutting a first surface of a workpiece with the cutting tool;
- peening the first surface of the workpiece with the peening tool that focuses a laser beam onto the first surface of the workpiece;
- and
- supporting a second surface of the workpiece with the cutting tool without cutting the second surface, wherein the supporting of the second surface of the workpiece is performed while the peening of the first surface of the workpiece is performed by the peening tool.
1 more element
Dependencies are inferred from the claim text.