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US 9,531,933 B2Granted
Camera module
AssigneeLG Innotek Co., Ltd.
InventorsHyun Ah Oh, Youn Baek Jeong, Se Jin Lee
Life of this patent
Estimating the term…
Abstract
Exemplary embodiments of a camera module are proposed, the camera module including a PCB (Printed Circuit Board) mounted with an image sensor, a base installed at an upper surface of the PCB and formed with a window at a position corresponding to that of the image sensor, an IRCF (Infrared Cut Filter) installed at an upper surface of the base, and an adhesive member fixing the IRCF to the base.
Claims10
A camera module, the camera module comprising:
- at least one lens;
- a substrate disposed under the lens;
- an image sensor disposed on an upper surface of the substrate;
- a dam disposed on an upper surface of the image sensor;
- and
- a dust trap disposed on the upper surface of the image sensor outside the dam.
3 more elements
Dependencies are inferred from the claim text.