Movement microelectromechanical systems (MEMS) package

A microelectromechanical systems (MEMS) package comprising:

• a CMOS substrate having an upper surface and a lower surface;
• a monocrystalline silicon device substrate bonded to the upper surface of the CMOS substrate and comprising a movable or flexible MEMS device;
• and
• a conformal anti-stiction layer lining a lower lateral surface of the movable or flexible MEMS device proximate to the upper surface of the CMOS substrate, but not lining inner sidewalls or an upper lateral surface of the movable or flexible MEMS device opposite to the lower lateral surface.

A method for manufacturing a microelectromechanical systems (MEMS) device, the method comprising:

• forming a cap substrate having a recess in a front side of the cap substrate;
• bonding the cap substrate to a MEMS device substrate made of monocrystalline silicon such that the cap substrate and MEMS device substrate collectively enclose the recess and thereby form a cavity;
• depositing a conformal polycrystalline silicon layer to cover an exposed surface of the MEMS device substrate opposite to the cap substrate;
• and
• after the conformal polycrystalline silicon layer is deposited, patterning the MEMS device substrate and the conformal polycrystalline silicon layer to form a movable or flexible MEMS device, such that the conformal polycrystalline silicon layer is not disposed on sidewalls or a lateral surface of the MEMS device substrate proximate to the cap substrate.