# US 9,521,795 B2 · Two-step direct bonding processes and tools for performing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,521,795 B2 - Document ID: US9521795B2 - Status: Granted - Kind: B2 - Application number: 13/866,858 - Filed: 2013-04-19 - Published: 2014-09-18 - Granted: 2016-12-13 - Earliest claimed: 2013-03-12 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Company, Ltd. - Inventors: Yi-Li Hsiao; Da-Yuan Shih; Chih-Hang Tung; Chen-Hua Yu - Web page: https://patentgrep.com/patent/US9521795B2 ## CPC - H05K 13/0465: {by soldering (H05K13/0469 takes precedence)} - H10W 72/016: {of strap connectors} - H10W 72/0198: {batch processes} - H10W 72/0711: {Apparatus therefor} - H10W 72/07125: {Means for controlling the bonding environment, e.g. valves or vacuum pumps} - H10W 72/07141: {Means for applying energy, e.g. ovens or lasers} - H10W 72/07178: {Means for aligning} - H10W 72/07188: {Apparatus chuck} - H10W 72/072: {of bump connectors} - H10W 72/07232: {Compression bonding, e.g. thermocompression bonding} - H10W 72/241: {Dispositions, e.g. layouts} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method includes placing a plurality of first package components over second package components, which are included in a third package component. First metal connectors in the first package components are aligned to respective second metal connectors of the second package components. After the plurality of first package components is placed, a metal-to-metal bonding is performed to bond the first metal connectors to the second metal connectors. ## Claims ### Claim 1 A method comprising: placing a package component group over a bottom jig, wherein the package component group comprises a plurality of first package components, with neighboring ones of the plurality of first package components contact with each other to form the package component group; placing a plurality of second package components over the plurality of first package components, wherein the plurality of first package components and the plurality of second package components in combination form a modified package component group, wherein first metal connectors in the plurality of first package components are aligned to respective second metal connectors of the plurality of second package components; placing a top jig over the plurality of first package components; securing the bottom jig, the top jig, and the modified package component group using a clamp to form an integrated jig assembly; stacking a plurality of weight units over the plurality of second package components, wherein the plurality of weight unit comprises: a first weight unit having a first weight; and a second weight unit having a second weight different from the first weight unit; and performing a metal-to-metal bonding on the integrated jig assembly to bond the first metal connectors to the second metal connectors, wherein each of the plurality of weight units applies a weight on respective underlying ones of the plurality of second package components individually during the metal-to-metal bonding. ### Claim 2 (depends on 1) The method of claim 1, wherein the first metal connectors and the second metal connectors are free from solder, and wherein each of the first metal connectors is in physical contact with one of the second metal connectors. ### Claim 3 (depends on 1) The method of claim 1, wherein at least one of the first metal connectors and the second metal connectors comprises solder. ### Claim 4 (depends on 1) The method of claim 1, wherein the top jig comprises landing units, and wherein the landing units are configured to tilt in response to tilted top surfaces of the respective underlying ones of the plurality of second package components. ### Claim 5 (depends on 1) The method of claim 1, wherein the first weight is applied to a first one of the plurality of second package components during the metal-to-metal bonding; and the second weight is applied to a second one of the plurality of second package components during the metal-to-metal bonding. ### Claim 6 A method comprising: placing a plurality of first package components over a plurality of second package components, wherein the plurality of second package components in combination form a third package component, and neighboring ones of the plurality of second package components contact with each other, wherein first metal connectors in the first package components are aligned to respective second metal connectors of the a plurality of second package components; placing a top jig over the plurality of first package components, wherein the top jig comprises a plurality of landing units, each comprising an elastic coating, and wherein each of the plurality of landing units is configured to tilt in response to tilted top surfaces of the respective underlying ones of the plurality of first package components; stacking a plurality of weight units over the plurality of landing units; and performing a metal-to-metal bonding to bond the first metal connectors to the second metal connectors, wherein each of the plurality of weight units applies a weight on a respective underlying one of the plurality of first package components individually during the metal-to-metal bonding. ### Claim 7 (depends on 6) The method of claim 6, wherein the first metal connectors and the second metal connectors are free from solder, and wherein each of the first metal connectors is in physical contact with one of the second metal connectors. ### Claim 8 (depends on 6) The method of claim 6, wherein at least one of the first metal connectors and the second metal connectors comprises solder. ### Claim 9 (depends on 6) The method of claim 6 further comprising: before the placing the plurality of first package components, placing the third package component over a bottom jig; and securing the bottom jig, the top jig, the plurality of first package components, and the third package component using a clamp to form an integrated jig assembly. ### Claim 10 (depends on 6) The method of claim 6, wherein the plurality of weight unit comprises a first weight unit having a first weight, and a second weight unit having a second weight different from the first weight unit. ### Claim 11 (depends on 5) The method of claim 5, wherein the first weight and the second weight are applied simultaneously. ### Claim 12 (depends on 1) The method of claim 1, wherein the clamp comprises a first leg penetrating into the top jig, and a second leg penetrating into the bottom jig. ### Claim 13 (depends on 9) The method of claim 9, wherein the clamp comprises a first leg penetrating into the top jig, and a second leg penetrating into the bottom jig. ### Claim 14 A method comprising: placing a package component group over a bottom jig, wherein the package component group comprises a plurality of first package components, with neighboring ones of the plurality of first package components contact with each other to form the package component group; placing a plurality of second package components over the plurality of first package components, wherein the plurality of first package components and the plurality of second package components in combination form a modified package component group, wherein first metal connectors in the plurality of first package components are aligned to respective second metal connectors of the plurality of second package components; placing a top jig over the plurality of first package components, wherein the top jig comprises landing units having elastic outer portions, and wherein the landing units are configured to tilt in response to tilted top surfaces of the respective underlying ones of the plurality of second package components; securing the bottom jig, the top jig, and the modified package component group using a clamp to form an integrated jig assembly; stacking a plurality of weight units over the plurality of second package components, wherein the plurality of weight unit comprises: a first weight unit having a first weight; and a second weight unit having a second weight different from the first weight unit; and performing a metal-to-metal bonding on the integrated jig assembly to bond the first metal connectors to the second metal connectors, wherein each of the plurality of weight units applies a weight on respective underlying ones of the plurality of second package components individually during the metal-to-metal bonding. ### Claim 15 (depends on 14) The method of claim 14, wherein the first metal connectors and the second metal connectors are free from solder, and wherein each of the first metal connectors is in physical contact with one of the second metal connectors. ### Claim 16 (depends on 14) The method of claim 14, wherein at least one of the first metal connectors and the second metal connectors comprises solder. ### Claim 17 (depends on 14) The method of claim 14, wherein: the first weight is applied to a first one of the plurality of second package components during the metal-to-metal bonding; and the second weight is applied to a second one of the plurality of second package components during the metal-to-metal bonding. ### Claim 18 (depends on 17) The method of claim 17, wherein the first weight and the second weight are applied simultaneously. ### Claim 19 (depends on 14) The method of claim 14, wherein the clamp comprises a first leg penetrating into the top jig, and a second leg penetrating into the bottom jig. ### Claim 20 (depends on 14) The method of claim 14, wherein the elastic outer portions are formed of a silicone based material.