# US 9,521,777 B2 · Cooling system for electronic components and led lamp having the same

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- Number: US 9,521,777 B2
- Document ID: US9521777B2
- Status: Granted
- Kind: B2
- Application number: 13/993,236
- Filed: 2011-11-30
- Published: 2013-10-31
- Granted: 2016-12-13
- Earliest claimed: 2010-12-20
- Assignees: Tridonic Jennersdorf GmbH
- Applicants: Istvan Bakk
- Inventors: Istvan Bakk
- Web page: https://patentgrep.com/patent/US9521777B2

## CPC

- H05K 7/20136: {Forced ventilation, e.g. by fans (H05K7/202 takes precedence)}
- F04F 7/00: Pumps displacing fluids by using inertia thereof, e.g. by generating vibrations therein
- F21K 9/23: Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K 9/232: specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
- F21V 29/503: of light sources (cooling arrangements structurally associated with gas-discharge or vapour-discharge lamps H01J61/52; cooling arrangements structurally associated with electric incandescent lamps H01K1/58; cooling arrangements structurally associated with light-emitting diodes H10H20/858)
- F21V 29/63: using electrically-powered vibrating means; using ionic wind
- F21V 29/74: with fins or blades
- H10W 40/43: by flowing gases, e.g. forced air cooling
- H10W 40/475: {using jet impingement (H10W40/776 takes precedence)}
- F21V 29/83: the elements having apertures, ducts or channels, e.g. heat radiation holes
- F21Y 2115/10: Light-emitting diodes [LED]
- Y02B 20/30: Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- F04F: PUMPING OF FLUID BY DIRECT CONTACT OF ANOTHER FLUID OR BY USING INERTIA OF FLUID TO BE PUMPED {(evacuating by sorption F04B)}; SIPHONS {(conveying materials in bulk by flows of gas, liquid of foam B65G53/00)}
- F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- Y02B: CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS

## Abstract

The present invention is directed to a cooling system (1) for electronic components (4). The cooling system (1) comprises means (7) for producing cyclic air pressure fluctuations, wherein the electronic components (4) are distanced from the pressure producing means (7). In the vicinity of the electronic components (4) are situated means (5), preferably restrictions like holes, which are affected by the cyclic air pressure fluctuations, and which produce cyclic air jets (6). The air jets (6) affect the surface of the electronic component (4), and since the air jets (6) originate directly in the vicinity of the electronic components (4), an efficient heat transfer is affected. Preferably, the pressure producing means (7) actuate a pressure Pc inside a chamber (2), and turbulent air jets (6) are produced through holes (5) of a substrate (3), onto which electronic components (4) are mounted.

## Claims

### Claim 1

A cooling system (1) for electronic components (4) comprising
means (7) for producing cyclic air pressure fluctuations, wherein the electronic components (4) are distanced from the pressure producing means (7);
converting means (5) for converting the cyclic air pressure fluctuations into cyclic air jets (6), wherein the converting means (5) are arranged in the vicinity of the electronic components (4), so that the cyclic air jets (6) are turbulent air streams and produced directly at the location of the electronic components (4) in order to increase the heat transfer at the surface of the electronic components (4), and
wherein the converting means (5) comprises at least one opening in a range of 100 μm to 8 mm and wherein a distance between the electronic components (4) and the converting means (5) is less than 10 mm
wherein the cooling system (1) further comprises
a chamber (2), wherein the pressure producing means (7) are provided and produce a cyclic chamber air pressure (Pc), which is alternately higher and lower than the air pressure (Po) outside of the chamber (2);
a substrate (3) constituting one side wall of the chamber (2), the electronic components (4) being attached to a surface of the substrate (3);
wherein the substrate (3) is provided with at least one hole (5), which produces the cyclic air jets (6) due to the cyclic chamber air pressure (Pc).

### Claim 2 (depends on 1)

The cooling system (1) according to claim 1, wherein the pressure producing means (7) comprise at least one membrane, which is adapted to be driven to suck in and expulse air in two movement phases, respectively, wherein the two-movement phases are cycled 5 to 500 times per second.

### Claim 3 (depends on 2)

The cooling system (1) according to claim 2, wherein the at least one membrane is adapted to be magnetically driven.

### Claim 4 (depends on 1)

The cooling system (1) according to claim 1, wherein the pressure producing means (7) comprise a pump, which contains a piezoelectric element.

### Claim 5 (depends on 1)

The cooling system (1) according to claim 1, further comprising a heat sink (8), which is connected to the substrate (3) and/or at least one of the electronic components (4).

### Claim 6 (depends on 5)

The cooling system (1) according to claim 5, further comprising a plurality of heatsink fins (9), which are connected to the substrate (3) and/or at least one of the electronic components (4) and/or the heat sink (8), wherein the cyclic air jets (6) impinge on the heatsink fins (9).

### Claim 7 (depends on 1)

The cooling system (1) according to claim 1, wherein apart from the at least one hole (5) the chamber (2) is hermetically sealed to the outside.

### Claim 8 (depends on 1)

The cooling system (1) according to claim 1, wherein the at least one hole (5) is provided with restrictions (5a) to enhance the turbulence of the air jets (6).

### Claim 9 (depends on 1)

A LED lamp (100), especially retrofit LED lamp, operating with electronic components (4), wherein the LED lamp (100) has a cooling system (1) according to claim 1 for the electronic components (4).

### Claim 10 (depends on 9)

The LED lamp (100) according to claim 9, comprising
a bulb (10), which is provided on one of its ends with a socket (11);
at least one LED (12) arranged inside the envelope (13);
wherein the cooling system (1) is arranged inside envelope (13), such that the electronic components (4) are positioned between the pressure producing means (7) and the socket (11), wherein the electronic components (4) drive the at least one LED (12).

### Claim 11 (depends on 10)

The LED lamp (100) according to claim 10, further comprising heatsink fins (9), wherein the heatsink fins (9) are arranged on such a way that the path of the cyclic air jets (6) are directed along the heat fins (9) towards the socket (11).

### Claim 12 (depends on 2)

The cooling system (1) according to claim 2, wherein the two-movement phases are cycled 20 to 120 times per second.

### Claim 13

A cooling method for electronic components (4) comprising the steps of
producing cyclic air pressure fluctuations by means (7), which are distanced from the electronic components (4);
producing cyclic air jets (6) by converting means (5) arranged in the vicinity of the electronic components (4), so that the cyclic air jets (6) are turbulent air streams and produced directly at the location of the electronic components (4), wherein the converting means (5) being affected by the cyclic air pressure fluctuations, and wherein the cyclic air jets (6) affect the surface of the electronic components (4),
wherein the converting means (5) comprises at least one opening in a range of 100 μm to 8 mm and wherein a distance between the electronic components (4) and the converting means (5) is less than 10 mm
creating a cyclic chamber air pressure (Pc) in a chamber (2), the air pressure (Pc) being alternately higher and lower than the air pressure (Po) outside of the chamber (2); and
producing the cyclic air jets (6) due to the cyclic chamber air pressure (Pc) by at least one hole (5) in a substrate (3), to which the electronic components (4) are attached.