# US 9,521,764 B2 · Tamper respondent apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,521,764 B2 - Document ID: US9521764B2 - Status: Granted - Kind: B2 - Application number: 14/563,902 - Filed: 2014-12-08 - Published: 2015-06-11 - Granted: 2016-12-13 - Earliest claimed: 2013-12-09 - Assignees: Timothy Steiner - Applicants: Timothy Wayne Steiner - Inventors: Timothy Wayne Steiner - Web page: https://patentgrep.com/patent/US9521764B2 ## CPC - H05K 5/0208: {Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof} - B33Y 80/00: Products made by additive manufacturing - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B33Y: ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING ## Abstract A tamper respondent apparatus having an enclosure comprising of an electrically conductive material layer configured to substantially form continuous electrically conductive paths, an electrically non-conductive material layer forming an outer layer configured to substantially insulate said electrically conductive material layer, an electrical connector at a corner of an underside surface of said enclosure, whereby said conductive material layer and non-conductive material layer are extruded or deposited in successive layers by a three dimensional printer, wherein said electrically conductive material layer forms an inner layer of said extrusion of said three dimensional printer, and wherein a cohesive strength of said conductive material layer is configured to be less than a cohesive strength of said non-conductive material layer. ## Claims ### Claim 1 An apparatus, comprising; a tamper respondent enclosure implement comprising; an electrically conductive material layer section configured to substantially form continuous electrically conductive paths, in which said electrically conductive material layer section comprising at least a first and second electrically conductive material layer segment; an electrically non-conductive material layer section configured to substantially insulate said electrically conductive material layer, in which said electrically non-conductive material layer section comprising at least a first, second and third electrically non-conductive material layer segment; whereby said at least first and second conductive material layer segments and said at least first and second non-conductive material layer section are configured to form alternating successive layers; wherein said first electrically non-conductive material layer segment generally forms an outer layer of said enclosure; and wherein said first and second electrically conductive material layer segment forms at least an inner layer of said extrusion of said three dimensional printer device, and wherein a cohesive strength of said first conductive material layer segment is configured to be less than a cohesive strength of said first and second non-conductive material layer segment and a cohesive strength of said second conductive material layer segment is configured to be less than a cohesive strength of said second non-conductive material layer segment, in which said cohesive strength of said first conductive material layer segment is further configured to be operable to ensure attempts to delaminate said first conductive material layer segment from said first non-conductive material layer segment will result in a substantial fracture of said first conductive material layer segment and said cohesive strength of said second conductive material layer segment is further configured to be operable to ensure attempts to delaminate at least one of, said first and second conductive material layer segment from said second non-conductive material layer segment will result in a substantial fracture of at least one of, said first and second conductive material layer segment; and an electrical connector at a corner of an underside surface of said tamper respondent enclosure implement, in which said electrical connector comprise of at least two or more electrical connectors. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein said tamper respondent enclosure implement is formed around an object to protect, in which said at least two or more electrical connectors being disposed at each corner of an underside surface of said tamper respondent enclosure implement, and wherein said at least two or more electrical connectors being configured to coordinate with electrical connectors disposed on a surface of said object to generally provide electrical connection and secure said tamper respondent enclosure implement to said object. ### Claim 3 (depends on 1) The apparatus of claim 1, wherein said tamper respondent enclosure implement is configured to be mounted on a surface of a printed circuit board, in which; said electrical connector being configured to provide electrical continuity between said first and second conductive material layer segments and said printed circuit board; and said apparatus further comprising a sensing device connected to said first and second conductive material layer segments, wherein said sensing device is configured to sense attempts to tamper said first and second conductive material layer segments. ### Claim 4 (depends on 1) The apparatus of claim 1, wherein said electrically conductive material layer section is non-differentiable from said non-conductive material layer section by X-ray imaging. ### Claim 5 (depends on 1) The apparatus of claim 1, wherein said electrically conductive material layer section generally forms electrically conductive paths around a device to protect. ### Claim 6 (depends on 5) The apparatus of claim 5, wherein said electrically conductive material layer section forms a serpentine pattern. ### Claim 7 (depends on 5) The apparatus of claim 5, wherein said electrically conductive material layer section generally forms a rectilinear pattern. ### Claim 8 (depends on 5) The apparatus of claim 5, wherein said electrically conductive material layer section generally forms a zigzag pattern. ### Claim 9 (depends on 1) The apparatus of claim 1, wherein said electrically conductive material layer section is comprised of at least a conductive ink. ### Claim 10 (depends on 1) The apparatus of claim 1, wherein said electrically conductive material layer section is comprised of at least a conductive plastic. ### Claim 11 (depends on 1) The apparatus of claim 1, wherein said electrically conductive material layer section is comprised of at least a conductive polymer. ### Claim 12 (depends on 1) The apparatus of claim 1, wherein said electrically conductive material layer section contains at least conductive particles. ### Claim 13 (depends on 1) The apparatus of claim 1, wherein said electrically conductive material layer section is comprised of at least a metal. ### Claim 14 (depends on 5) The apparatus of claim 5, further comprising a sensing device, said sensing device is coupled to said tamper respondent enclosure implement through said electrical connector, wherein said sensing device is configured to detect changes in the electrical characteristic of said tamper respondent enclosure implement. ### Claim 15 (depends on 14) The apparatus of claim 14, further comprising an information device, said information device is coupled to said sensing device, wherein said sensing device is configured to provide a signal to said information device upon a detection of a change in the electrical characteristic of said tamper respondent enclosure implement. ### Claim 16 (depends on 1) The apparatus of claim 1, in which said tamper respondent enclosure implement comprise of at least two or more tamper respondent enclosures, wherein said at least two or more electrical connectors is configured to provide electrical continuity of said at least two or more tamper respondent enclosures.