# US 9,521,760 B2 · Rigid flexible printed circuit board and method of manufacturing the same

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- Number: US 9,521,760 B2
- Document ID: US9521760B2
- Status: Granted
- Kind: B2
- Application number: 14/282,490
- Filed: 2014-05-20
- Published: 2014-11-27
- Granted: 2016-12-13
- Earliest claimed: 2013-05-27
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Applicants: Samsung Electro-Mechanics Co., Ltd.
- Inventors: Yang Je Lee; Jee Hoon Kim; Jae Ho Shin; Hyung Ju Cho
- Web page: https://patentgrep.com/patent/US9521760B2

## CPC

- H05K 3/4691: {Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers}
- Y10T 156/10: Methods of surface bonding and/or assembly therefor
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A rigid flexible printed circuit board, having a rigid region and a flexible region, includes, in one embodiment: a base substrate including a portion in the rigid region and a portion in the flexible region; a coverlay formed on the base substrate; a first insulating layer formed on the coverlay and formed in the rigid region; a second insulating layer formed on the first insulating layer; and an outer layer circuit layer formed on the second insulating layer. Also described is a method of manufacturing a rigid flexible printed circuit board having a rigid region and a flexible region.

## Claims

### Claim 1

A rigid flexible printed circuit board having a rigid region and a flexible region, comprising:
a base substrate including a portion in the rigid region and a portion in the flexible region, and including an internal insulating layer and an inner layer circuit layer formed on the internal insulating layer;
a coverlay formed on the base substrate;
a first insulating layer formed on the coverlay and formed in the rigid region;
a second insulating layer formed on the first insulating layer;
an outer layer circuit layer formed on the second insulating layer; and
a via electrically connecting the inner layer circuit layer to the outer layer circuit layer by penetrating through the first insulating layer, the second insulating layer, and the coverlay,
wherein a glass transition temperature of the second insulating layer is 180° C. or more.

### Claim 2 (depends on 1)

The rigid flexible printed circuit board as set forth in claim 1, wherein the first insulating layer is laminated in a B stage and then hardened.

### Claim 3 (depends on 1)

The rigid flexible printed circuit board as set forth in claim 1, wherein the second insulating layer is a C-stage insulating layer.

### Claim 4 (depends on 1)

The rigid flexible printed circuit board as set forth in claim 1, further comprising:
a solder resist layer formed on the second insulating layer to bury the outer layer circuit layer.

### Claim 5 (depends on 1)

The rigid flexible printed circuit board as set forth in claim 1, wherein the coverlay is attached to the base substrate by an adhesive which is formed on one surface of the coverlay.

### Claim 6

A rigid flexible printed circuit board having a rigid region and a flexible region, comprising:
a base substrate including a portion in the rigid region and a portion in the flexible region, and including an internal insulating layer and an inner layer circuit layer formed on the internal insulating layer;
a coverlay formed on the base substrate;
a stop pattern formed on the coverlay of the rigid region and having a side surface exposed in the flexible region;
a first insulating layer formed on the coverlay and formed in the rigid region;
an outer layer circuit layer formed on the first insulating layer; and
a first via electrically connecting the inner layer circuit layer to the outer layer circuit layer by penetrating through the first insulating layer and the coverlay,
wherein a glass transition temperature of the first insulating layer is 180° C. or more.

### Claim 7 (depends on 6)

The rigid flexible printed circuit board as set forth in claim 6, further comprising:
a solder resist layer formed on the first insulating layer to bury the outer layer circuit layer.

### Claim 8 (depends on 6)

The rigid flexible printed circuit board as set forth in claim 6, wherein the coverlay is attached to the base substrate by an adhesive which is formed on one surface of the coverlay.

### Claim 9 (depends on 6)

The rigid flexible printed circuit board as set forth in claim 6, further comprising:
an adhesive layer formed between the coverlay and the first insulating layer.

### Claim 10 (depends on 6)

The rigid flexible printed circuit board as set forth in claim 6, further comprising:
a first circuit layer formed on the coverlay to be buried in the first insulating layer.

### Claim 11 (depends on 10)

The rigid flexible printed circuit board as set forth in claim 10, further comprising:
a second via electrically connecting the first circuit layer to the outer layer circuit layer by penetrating through the first insulating layer.

### Claim 12 (depends on 10)

The rigid flexible printed circuit board as set forth in claim 10, wherein the stop pattern is a portion of a circuit layer formed on the coverlay.

### Claim 13

A rigid flexible printed circuit board having a rigid region and a flexible region, comprising:
a base substrate including a portion in the rigid region and a portion in the flexible region, and including an internal insulating layer and an inner layer circuit layer formed on the internal insulating layer;
a coverlay formed on the base substrate;
an insulating layer formed on the coverlay and formed in the rigid region, the insulating layer having a boundary portion, at a boundary of the rigid region adjacent to the flexible region, that is on an intermediate member interposed between the boundary portion and the coverlay;
an outer layer circuit layer formed on the insulating layer; and
a via electrically connecting the inner layer circuit layer to the outer layer circuit layer by penetrating through the insulating layer and the coverlay,
wherein a glass transition temperature of the insulating layer is 180° C. or more.

### Claim 14 (depends on 13)

The rigid flexible printed circuit board of claim 13, wherein the base substrate is a patterned flexible copper clad laminate (FCCL), and in the flexible region, the coverlay covers a circuit pattern formed on the base substrate.