# US 9,521,758 B2 · Semiconductor device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,521,758 B2 - Document ID: US9521758B2 - Status: Granted - Kind: B2 - Application number: 14/280,935 - Filed: 2014-05-19 - Published: 2014-12-11 - Granted: 2016-12-13 - Earliest claimed: 2013-06-05 - Assignees: Toyota Jidosha Kabushiki Kaisha; Denso Corporation - Applicants: Toyota Jidosha Kabushiki Kaisha; Denso Corporation - Inventors: Keita Hatasa; Arata Harada; Daisuke Harada - Web page: https://patentgrep.com/patent/US9521758B2 ## CPC - H05K 3/306: with lead-in-hole components (H05K3/32 takes precedence) - H05K 2201/10166: Transistor - H05K 2201/10409: Screws - H05K 2201/10424: Frame holders - H05K 2201/2027: Guiding means, e.g. for guiding flexible circuits - H05K 2203/167: Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/00: Package configurations - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor device includes a semiconductor module that has an electrode terminal projecting externally; a substrate that has a through hole or a cut-out for inserting the electrode terminal; and a guide member that is provided between the semiconductor module and the substrate and guides the electrode terminal in such a manner that the electrode terminal is inserted into the through hole or the cut-out. The guide member becomes out of contact with the electrode terminal after the electrode terminal is inserted into the through hole or the cut-out. ## Claims ### Claim 1 A semiconductor device comprising: a semiconductor module that has an electrode terminal projecting externally; a substrate that has a through hole or a cut-out for inserting the electrode terminal; and a guide member that is provided between the semiconductor module and the substrate and guides the electrode terminal in such a manner that the electrode terminal is inserted into the through hole or the cut-out, wherein the guide member is not in contact with the electrode terminal after insertion of the electrode terminal is inserted into the through hole or the cut-out, wherein the guide member includes a plurality of members movable with respect to the substrate, before the electrode terminal is inserted into the through hole or the cut-out, the respective ones of the plurality of members move in predetermined directions and form the guiding part as a result of joining together, and after the electrode terminal is inserted into the through hole or the cut-out, the respective ones of the plurality of members move in directions opposite to the predetermined directions and move away from each other so that the guiding part becomes out of contact with the electrode terminal. ### Claim 2 (depends on 1) The semiconductor device as claimed in claim 1, wherein the guide member includes a guiding part that guides the electrode terminal while being in contact with the electrode terminal in such a manner that the electrode terminal is inserted into the through hole or the cut-out, wherein the guiding part becomes out of contact with the electrode terminal after the electrode terminal is inserted into the through hole or the cut-out. ### Claim 3 (depends on 1) The semiconductor device as claimed in claim 1, wherein the guiding part has a tapered shape such that an end at which the electrode terminal is inserted is wider than an opposite end. ### Claim 4 (depends on 3) The semiconductor device as claimed in claim 3, wherein contact surfaces on which the respective ones of the plurality of members come into contact with each other when joining together are inclined with respect to a direction perpendicular to a surface of the substrate on which the through hole or the cut-out is formed. ### Claim 5 (depends on 4) The semiconductor device as claimed in claim 4, further comprising the plurality of members are positioned with respect to each other. ### Claim 6 (depends on 5) The semiconductor device as claimed in claim 5, wherein an elastic member is provided connecting the plurality of members. ### Claim 7 (depends on 3) The semiconductor device as claimed in claim 3, further comprising the plurality of members are positioned with respect to each other. ### Claim 8 (depends on 7) The semiconductor device as claimed in claim 7, wherein an elastic member is provided connecting the plurality of members. ### Claim 9 (depends on 1) The semiconductor device as claimed in claim 1, wherein contact surfaces on which the respective ones of the plurality of members come into contact with each other when joining together are inclined with respect to a direction perpendicular to a surface of the substrate on which the through hole or the cut-out is formed. ### Claim 10 (depends on 9) The semiconductor device as claimed in claim 9, further comprising the plurality of members are positioned with respect to each other. ### Claim 11 (depends on 10) The semiconductor device as claimed in claim 10, wherein an elastic member is provided connecting the plurality of members. ### Claim 12 (depends on 1) The semiconductor device as claimed in claim 1, further comprising the plurality of members are positioned with respect to each other. ### Claim 13 (depends on 12) The semiconductor device as claimed in claim 12, wherein an elastic member is provided connecting the plurality of members. ### Claim 14 A semiconductor device comprising: a semiconductor module having an electrode terminal projecting externally; a substrate having a through hole or a cut-out configured to receive the electrode terminal; and a guide member provided between the semiconductor module and the substrate, the guide member being configured to guide the electrode terminal into the through hole or the cut-out by aligning the electrode terminal in a direction of an opening of the through hole or the cut-out in response to the electrode terminal being inserted into the through-hole or cut-out, and, the guide member is not in contact with the electrode terminal after insertion of the electrode terminal into the through hole or the cut-out; wherein the guide member includes a plurality of members movable with respect to the substrate, before the electrode terminal is inserted into the through hole or the cut-out, the respective ones of the plurality of members move in predetermined directions and form the guiding part as a result of joining together, and after the electrode terminal is inserted into the through hole or the cut-out, the respective ones of the plurality of members move in directions opposite to the predetermined directions and move away from each other so that the guiding part becomes out of contact with the electrode terminal.