# US 9,521,757 B2 · Systems and methods for loading of a component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,521,757 B2 - Document ID: US9521757B2 - Status: Granted - Kind: B2 - Application number: 14/595,987 - Filed: 2015-01-13 - Published: 2016-07-14 - Granted: 2016-12-13 - Earliest claimed: 2015-01-13 - Assignees: Dell Products L.P. - Applicants: Dell Products L.P. - Inventors: Lawrence A. Kyle; Robert Johnson - Web page: https://patentgrep.com/patent/US9521757B2 ## CPC - H05K 3/301: {by means of a mounting structure (H05K3/325 takes precedence)} - H05K 1/0201: {Thermal arrangements, e.g. for cooling, heating or preventing overheating} - H05K 1/0204: {using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence)} - H05K 7/1061: {co-operating by abutting} - H05K 7/12: Resilient or clamping means for holding component to structure - H10W 40/611: {Bolts or screws} - H10W 40/231: {characterised by their places of attachment or cooling paths} - H10W 40/235: {attached to package parts} - H10W 40/242: {comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders} - H10W 40/60: Securing means for detachable heating or cooling arrangements, e.g. clamps - H10W 40/641: {Snap-on arrangements, e.g. clips} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract In a component loading system, a circuit board may include a socket, a first plurality of holes, and a second plurality of holes. A frame may include two opposing sidewalls each substantially perpendicular to a surface of the circuit board and coupled to one another via a plate, a plurality of threaded channels, each channel adjacent to one of the two opposing sidewalls and located between the two opposing sidewalls, and a third plurality of holes. A backing plate may include a plurality of heat dissipater mounting posts and a fourth plurality of holes. A plurality of second fasteners may each be mechanically engaged to a respective one of the plurality of threaded channels and passing through a respective one of the second plurality of holes to mechanically secure the frame and backplate on opposite sides of the circuit board. ## Claims ### Claim 1 A component loading system, comprising: a circuit board comprising: a socket; a first plurality of holes; and a second plurality of holes; a frame comprising: two opposing sidewalls each substantially perpendicular to a surface of the circuit board and coupled to one another via a plate; a plurality of threaded channels, each channel adjacent to one of the two opposing sidewalls and located between the two opposing sidewalls; and a third plurality of holes; a backing plate comprising: a plurality of heat dissipater mounting posts; and a fourth plurality of holes; a plurality of first fasteners each mechanically engaged to a respective heat dissipater mounting post passing through a respective one of the third plurality of holes and a respective one of the first plurality of holes to mechanically secure the frame and backplate on opposite sides of the circuit board; and a plurality of second fasteners each mechanically engaged to a respective one of the plurality of threaded channels and passing through a respective one of the second plurality of holes to mechanically secure the frame and backplate on opposite sides of the circuit board. ### Claim 2 (depends on 1) The component loading system of claim 1, the sidewalls arranged in relation to each other and the socket in order to mechanically guide a package comprising a processor into the component loading system. ### Claim 3 (depends on 2) The component loading system of claim 2, wherein the package comprises a processor/heat dissipater module comprising a processor mechanically coupled to a heat dissipater. ### Claim 4 (depends on 1) The component loading system of claim 1, wherein each of the plurality of heat dissipater mounting posts are configured to engage with a respective fastener of a heat dissipater. ### Claim 5 (depends on 1) The component loading system of claim 1, further comprising a heat dissipater comprising a plurality of spring-loaded fasteners each mechanically coupled to a respective one of the plurality of heat dissipater mounting posts, the spring-loaded fasteners each having a spring force providing mechanical loading for thermally coupling the heat dissipater to a processor electrically coupled to the socket. ### Claim 6 (depends on 5) The component loading system of claim 5, the heat dissipater integral to a processor/heat dissipater module further comprising a processor mechanically coupled to the heat dissipater, and the spring-loaded fasteners each having a spring force providing mechanical loading for electrically mating the processor to the socket. ### Claim 7 (depends on 5) The component loading system of claim 5, wherein the processor is mechanically secured to the socket by a wire bale retention mechanism. ### Claim 8 A method comprising: providing a circuit board comprising: a socket; a first plurality of holes; and a second plurality of holes; providing a frame comprising: two opposing sidewalls each substantially perpendicular to a surface of the circuit board and coupled to one another via a plate; a plurality of threaded channels, each channel adjacent to one of the two opposing sidewalls and located between the two opposing sidewalls; and a third plurality of holes; providing a backing plate comprising: a plurality of heat dissipater mounting posts; and a fourth plurality of holes; and mechanically securing the frame and the backplate on opposite sides of the circuit board via: a plurality of first fasteners each mechanically engaged to a respective heat dissipater mounting post passing through a respective one of the third plurality of holes and a respective one of the first plurality of holes to mechanically secure the frame and backplate on opposite sides of the circuit board; and a plurality of second fasteners each mechanically engaged to a respective one of the plurality of threaded channels and passing through a respective one of the second plurality of holes to mechanically secure the frame and backplate on opposite sides of the circuit board. ### Claim 9 (depends on 8) The method of claim 8, further comprising guiding a package comprising a processor into the component loading system. ### Claim 10 (depends on 9) The component loading system of claim 9, wherein the package comprises a processor/heat dissipater module comprising a processor mechanically coupled to a heat dissipater. ### Claim 11 (depends on 8) The method of claim 8, further comprising mechanically coupling a heat dissipater to the plurality of heat dissipater mounting posts, each heat dissipater comprising a plurality of spring-loaded fasteners each mechanically coupled to a respective one of the plurality of heat dissipater mounting posts, the spring-loaded fasteners each having a spring force providing mechanical loading for thermally coupling the heat dissipater to a processor electrically coupled to the socket. ### Claim 12 (depends on 11) The method of claim 11, further comprising mechanically securing the processor to the socket by a wire bale retention mechanism. ### Claim 13 (depends on 8) The method of claim 8, further comprising mechanically coupling a processor/heat dissipater module to the plurality of heat dissipater mounting posts, each heat dissipater comprising a plurality of spring-loaded fasteners each mechanically coupled to a respective one of the plurality of heat dissipater mounting posts, the spring-loaded fasteners each having a spring force providing mechanical loading for electrically mating a processor to the socket. ### Claim 14 An information handling system comprising: a circuit board comprising: a socket; a first plurality of holes; and a second plurality of holes; a memory communicatively coupled to the socket; a frame comprising: two opposing sidewalls each substantially perpendicular to a surface of the circuit board coupled to one another via a plate; a plurality of threaded channels, each channel adjacent to one of the two opposing sidewalls and located between the two opposing sidewalls; and a third plurality of holes; a backing plate comprising: a plurality of heat dissipater mounting posts; and a fourth plurality of holes; a plurality of first fasteners each mechanically engaged to a respective heat dissipater mounting post passing through a respective one of the third plurality of holes and a respective one of the first plurality of holes to mechanically secure the frame and backplate on opposite sides of the circuit board; and a plurality of second fasteners each mechanically engaged to a respective one of the plurality of threaded channels and passing through a respective one of the second plurality of holes to mechanically secure the frame and backplate on opposite sides of the circuit board. ### Claim 15 (depends on 14) The information handling system of claim 14, the sidewalls arranged in relation to each other and the socket in order to mechanically guide a package comprising a processor into the component loading system. ### Claim 16 (depends on 15) The information handling system of claim 15, wherein the package comprises a processor/heat dissipater module comprising a processor mechanically coupled to a heat dissipater. ### Claim 17 (depends on 14) The information handling system of claim 14, wherein each of the plurality of heat dissipater mounting posts are configured to engage with a respective fastener of a heat dissipater. ### Claim 18 (depends on 14) The information handling system of claim 14, further comprising a heat dissipater comprising a plurality of spring-loaded fasteners each mechanically coupled to a respective one of the plurality of heat dissipater mounting posts, the spring-loaded fasteners each having a spring force providing mechanical loading for thermally coupling the heat dissipater to a processor electrically coupled to the socket. ### Claim 19 (depends on 18) The information handling system of claim 18, the heat dissipater integral to a processor/heat dissipater module further comprising a processor mechanically coupled to the heat dissipater, and the spring-loaded fasteners each having a spring force providing mechanical loading for electrically mating the processor to the socket. ### Claim 20 (depends on 18) The information handling system of claim 18, wherein the processor is mechanically secured to the socket by a wire bale retention mechanism.