# US 9,521,756 B2 · Power module package and method of fabricating the same

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- Number: US 9,521,756 B2
- Document ID: US9521756B2
- Status: Granted
- Kind: B2
- Application number: 14/339,080
- Filed: 2014-07-23
- Published: 2015-07-09
- Granted: 2016-12-13
- Earliest claimed: 2014-01-08
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Applicants: Samsung Electro-Mechanics Co., Ltd.
- Inventors: Young Ki Lee; Sun Woo Yun; Jun Woo Myung
- Web page: https://patentgrep.com/patent/US9521756B2

## CPC

- H05K 3/0014: {Shaping of the substrate, e.g. by moulding}
- H10W 40/778: {in encapsulations}
- H10W 90/00: Package configurations
- H10W 90/811: {Multiple chips on leadframes}
- H05K 1/0209: {External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings}
- H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)}
- H05K 2201/0154: Polyimide
- H05K 2201/066: Heatsink mounted on the surface of the printed circuit board [PCB]
- H10W 72/07554: {changes in dispositions}
- H10W 72/547: {Dispositions of multiple bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/753: {between laterally-adjacent chips}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Disclosed herein is a power module package including a heat radiating plate including a step difference portion around an edge portion thereof, a semiconductor chip mounted on a mounting surface of the heat radiating plate, an external connection terminal disposed on an outer periphery of the heat radiating plate, electrically connected to the semiconductor chip, and protruding outwards, a wire for electrical connection between the semiconductor chip and the external connection terminal; and a molding portion for encapsulation of the semiconductor chip and a portion of the heat radiating plate, and in particular, the molding portion does not intrude over an exposed surface of the lower portion of the heat radiating plate through the step difference portion. In addition, disclosed herein is a fabricating method for preventing flush of the molding portion on the exposed surface.

## Claims

### Claim 1

A power module package comprising:
a heat radiating plate including a step difference portion around an edge portion thereof;
a semiconductor chip mounted on a mounting surface of the heat radiating plate;
an external connection terminal disposed on an outer periphery of the heat radiating plate, electrically connected to the semiconductor chip, and protruding outwards;
a wire for electrical connection between the semiconductor chip and the external connection terminal; and
a molding portion for encapsulation of the semiconductor chip and a portion of the heat radiating plate,
wherein the molding portion exposes a lower surface of the heat radiating plate through the step difference portion.

### Claim 2 (depends on 1)

The power module package as set forth in claim 1, wherein:
the heat radiating plate includes the mounting surface, an exposed surface opposite to the mounting surface, and a side wall surface connecting the mounting surface and the exposed surface; and
the step difference portion includes a step difference surface concaved towards a central region of the heat radiating plate from a lower portion of the side wall surface.

### Claim 3 (depends on 2)

The power module package as set forth in claim 2, wherein the step difference portion includes a step difference surface formed at a right angle with the exposed surface.

### Claim 4 (depends on 2)

The power module package as set forth in claim 2, wherein the step difference portion includes a chamfering portion formed at a boundary portion with the side wall surface.

### Claim 5 (depends on 4)

The power module package as set forth in claim 4, wherein the chamfering portion is rounded.

### Claim 6 (depends on 2)

The power module package as set forth in claim 2, wherein the step difference portion includes a concave portion concavely formed towards the central region of the heat radiating plate around the step difference surface just below the exposed surface.

### Claim 7 (depends on 6)

The power module package as set forth in claim 6, wherein the concave portion is formed at an acute angle with the exposed surface and is concavely formed at an edge portion of the exposed surface.