# US 9,521,755 B2 · Multilayer wiring board for an electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,521,755 B2 - Document ID: US9521755B2 - Status: Granted - Kind: B2 - Application number: 14/271,959 - Filed: 2014-05-07 - Published: 2014-08-28 - Granted: 2016-12-13 - Earliest claimed: 2003-07-02 - Assignees: Invensas Corporation - Applicants: Invensas Corporation - Inventors: Tomoo Iijima; Yoshitaka Fukuoka - Web page: https://patentgrep.com/patent/US9521755B2 ## CPC - H05K 3/4007: {Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465)} - H05K 1/0393: {Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)} - H05K 1/16: incorporating printed electric components, e.g. printed resistors, capacitors or inductors - H05K 1/162: {incorporating printed capacitors} - H05K 1/182: associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] - H05K 1/187: {the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier} - H05K 1/189: characterised by the use of flexible or folded printed circuits - H05K 3/46: Manufacturing multilayer circuits - H05K 3/4614: {the electrical connections between the circuit boards being made during lamination} - H05K 3/4635: {laminating flexible circuit boards using additional insulating adhesive materials between the boards} - H05K 3/4652: {Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern (H05K3/4647 takes precedence)} - H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs} - H05K 1/165: {incorporating printed inductors} - H05K 1/167: {incorporating printed resistors} - H05K 3/06: the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} - H05K 3/205: {using a pattern electroplated or electroformed on a metallic carrier} - H05K 2201/0367: Metallic bump or raised conductor not used as solder bump - H05K 2203/0384: Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer - Y10T 29/49155: Manufacturing circuit on or in base - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract An electronic assembly is disclosed that includes a flexible insulating film, a semiconductor component that has a thickness of less than 50 micrometers, a conductive interconnect extending through the flexible insulating film, a second patterned metal wiring film adjacent, and a third patterned metal wiring film. The second patterned metal wiring film is electrically coupled with the third patterned metal wiring film through the conductive interconnect. The semiconductor component is coupled to the first patterned metal wiring film and at least one of the second patterned metal wiring film or the third patterned metal wiring film. ## Claims ### Claim 1 An electronic assembly comprising: a flexible insulating film having a first major surface and a first patterned metal wiring film extending parallel to the first major surface; a semiconductor component positioned within the flexible insulating film and having a thickness of less than 50 micrometers; a conductive interconnect extending through the flexible insulating film; a second patterned metal wiring film adjacent a first external surface of the electronic assembly; and a third patterned metal wiring film adjacent a second external surface of the electronic assembly, wherein the second patterned metal wiring film is electrically coupled with the third patterned metal wiring film through the conductive interconnect, wherein the semiconductor component is coupled to the first patterned metal wiring film and at least one of the second patterned metal wiring film or the third patterned metal wiring film, and wherein the assembly includes a flexible portion and a rigid portion, the flexible portion including at least a portion of the flexible insulating film extending beyond the rigid portion of the assembly, and wherein the first patterned metal wiring film overlying the at least a portion of the flexible insulating film forms an external edge of the assembly and wherein the at least a portion of the first patterned metal wiring film extending beyond the rigid portion of the assembly is exposed. ### Claim 2 (depends on 1) The electronic assembly of claim 1, wherein the conductive interconnect is an etched metal bump interconnect. ### Claim 3 (depends on 1) The electronic assembly of claim 1, wherein the flexible portion includes at least a portion of the semiconductor component. ### Claim 4 (depends on 1) The electronic assembly of claim 1, wherein the conductive interconnect and the first patterned metal wiring film are integrally formed. ### Claim 5 (depends on 1) The electronic assembly of claim 1, further comprising a terminal disposed at the second external surface. ### Claim 6 (depends on 1) The electronic assembly of claim 1, further comprising a conductive mass overlying at least a portion of the terminal. ### Claim 7 (depends on 1) The electronic assembly of claim 1, further comprising a second flexible insulating film having a second major surface and a fourth patterned metal wiring film extending parallel to the second major surface. ### Claim 8 (depends on 1) The electronic assembly of claim 1, wherein the fourth patterned metal wiring film is electrically coupled with one of the first and second patterned metal wiring films. ### Claim 9 (depends on 1) The electronic assembly of claim 1, wherein the semiconductor component is positioned within the at least a portion of the flexible insulating film extending beyond the rigid portion of the assembly. ### Claim 10 (depends on 1) The electronic assembly of claim 1, wherein the semiconductor component is positioned within the at least a portion of the flexible insulating film extending beyond the rigid portion of the assembly. ### Claim 11 (depends on 1) The electronic assembly of claim 1, wherein the flexible insulating film has a free end, and the flexible portion of the assembly includes at least a portion of the free end of the flexible insulating film and the first patterned metal wiring film extending beyond the rigid portion of the assembly. ### Claim 12 An electronic assembly comprising: a first surface, an opposed second surface, and an edge surface extending at least partially between the first and second opposed surfaces; a first patterned metal wiring film extending parallel to the first surface of the assembly; a semiconductor component positioned within the flexible insulating film and having a thickness of less than 50 micrometers; a flexible insulating film having a first major surface parallel to the first surface and a second patterned metal wiring film, at least a portion of the flexible insulting film extending in a direction away from the edge surface of the assembly, and a plurality of conductive interconnects extending through the flexible insulating film, wherein the second patterned metal wiring film is electrically coupled with the first patterned metal wiring film through at least one of the plurality of conductive interconnects; and wherein the semiconductor component is coupled to the first patterned metal wiring film and the second patterned metal wiring film, and wherein the assembly includes a flexible portion and a rigid portion, the flexible portion including at least a portion of the flexible insulating film extending beyond the rigid portion of the assembly, and wherein the flexible insulating film has a free end, and the flexible portion of the assembly includes at least a portion of the free end of the flexible insulating film and the first patterned metal wiring film extending beyond the rigid portion of the assembly. ### Claim 13 (depends on 12) The electronic assembly of claim 12, wherein at least another portion of the flexible insulating film is disposed between the first and second opposed surfaces. ### Claim 14 (depends on 12) The electronic assembly of claim 12, further comprising a third patterned metal wiring film extending parallel to the second opposed surface. ### Claim 15 (depends on 12) The electronic assembly of claim 12, further comprising a terminal disposed at the second opposed surface. ### Claim 16 (depends on 15) The electronic assembly of claim 15, further comprising a conductive mass overlying at least a portion of the terminal. ### Claim 17 (depends on 14) The electronic assembly of claim 14, further comprising a second flexible insulating film having a second major surface and a fourth patterned metal wiring film extending parallel to the opposed second surface. ### Claim 18 (depends on 17) The electronic assembly of claim 17, wherein the third patterned metal wiring film is electrically coupled with at least one of the first and second patterned metal wiring films. ### Claim 19 (depends on 12) The electronic assembly of claim 12, wherein the plurality of conductive interconnects are a plurality of etched metal bump interconnects.