# US 9,521,754 B1 · Embedded components in a substrate

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- Number: US 9,521,754 B1
- Document ID: US9521754B1
- Status: Granted
- Kind: B1
- Application number: 14/463,361
- Filed: 2014-08-19
- Granted: 2016-12-13
- Earliest claimed: 2013-08-19
- Assignees: Multek Technologies Limited
- Applicants: Flextronics AP, LLC
- Inventors: Mark Bergman; Shurui Shang; Joan K. Vrtis
- Web page: https://patentgrep.com/patent/US9521754B1

## CPC

- H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
- H05K 1/183: associated with components mounted in and supported by recessed areas of the PCBs
- H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence)
- H05K 3/4652: {Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern (H05K3/4647 takes precedence)}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

An embedded component is formed in a PCB stack by applying an adhesive layer across an entire surface of a copper layer and selectively positioning the component on a portion of the adhesive layer. A B stage pre-preg layer having a component cut-out is added onto the adhesive layer such that the component adhered to the adhesive layer fits within the component cut-out of the B stage pre-preg layer. Another copper layer is added onto the B stage pre-preg layer and the PCB stack is laminated. Since B stage pre-preg is not fully cured, a gap between the component and a side wall of the component cut-out is filled by flow of the surrounding B stage pre-preg during the lamination step. One or more additional pre-preg and copper layers are added to the PCB stack with corresponding interconnects formed and coupled to the contact pads on the component.

## Claims

### Claim 1

A printed circuit board comprising:
a core substrate layer comprising a first copper layer laminated to a first surface of a first pre-preg layer and a second copper layer laminated to a second surface of the pre-preg layer;
an adhesive layer of a same material applied to an entire first surface of the first copper layer;
an electronic component having a first surface adhered to the adhesive layer;
a second pre-preg layer laminated to the first copper layer, wherein the second pre-preg layer includes a component cut-out and the second pre-preg layer is coupled to the adhesive layer and configured such that the electronic component fits within the component cut-out and the second pre-preg layer contacts the electronic component due to flow of the second pre-preg layer during lamination;
a third copper layer laminated to the second pre-preg layer.

### Claim 2 (depends on 1)

The printed circuit board of claim 1 wherein the electronic component comprises one or more contact pads on a second surface.

### Claim 3 (depends on 1)

The printed circuit board of claim 1 further comprising one or more additional pre-preg and copper layers laminated to the third copper layer.

### Claim 4 (depends on 1)

The printed circuit board of claim 1 further comprising one or more additional pre-preg and copper layers laminated to the second copper layer.

### Claim 5 (depends on 1)

The printed circuit board of claim 1 wherein the electronic component comprises an active electronic component.

### Claim 6 (depends on 1)

The printed circuit board of claim 1 wherein the electronic component comprises a passive electronic component.