# US 9,521,749 B2 · Circuit substrate and electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,521,749 B2 - Document ID: US9521749B2 - Status: Granted - Kind: B2 - Application number: 14/453,146 - Filed: 2014-08-06 - Published: 2015-02-12 - Granted: 2016-12-13 - Earliest claimed: 2013-08-09 - Assignees: Canon Kabushiki Kaisha - Applicants: Canon Kabushiki Kaisha - Inventors: Koichi Odagaki; Shuichi Kato - Web page: https://patentgrep.com/patent/US9521749B2 ## CPC - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 2201/09381: Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component - H05K 2201/099: Coating over pads, e.g. solder resist partly over pads - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract A circuit substrate which is capable of decreasing the possibility that the amount of solder in the overall mounting land is uneven and reducing formation of a solder void even when a mounting terminal has a large soldering area. An electronic component having the mounting terminal is mounted on the circuit substrate. A mounting land is connected to the mounting terminal of the electronic component by soldering, and the mounting land has a protruding portion of an insulating material formed so as to protrude from an outer side of the mounting land toward an inner side of the mounting land, and the protruding portion does not divide the mounting land into a plurality of areas. ## Claims ### Claim 1 A circuit substrate on which an electronic component having a mounting terminal and a signal terminal is mounted, comprising: a first mounting land configured to be connected to the mounting terminal by soldering; and a second mounting land configured to be connected to the signal terminal by soldering, wherein the first mounting land has a larger area than the second mounting land so as to increase reliability of connection between the circuit substrate and the electronic component when the electronic component is mounted on the circuit substrate, wherein said first mounting land is provided with a protruding portion of an insulating material formed so as to protrude from an outer side of said first mounting land toward an inner side of said first mounting land, wherein the protruding portion does not divide said first mounting land into a plurality of areas, and wherein said second mounting land is not provided with the protruding portion. ### Claim 2 (depends on 1) The circuit substrate according to claim 1, wherein the insulating material is a solder resist provided on surface wiring of the circuit substrate. ### Claim 3 (depends on 1) The circuit substrate according to claim 1, wherein the protruding portion is formed so as to protrude toward substantially a center of said first mounting land. ### Claim 4 (depends on 1) The circuit substrate according to claim 1, wherein said first mounting land is provided with a plurality of protruding portions, and the plurality of protruding portions is formed so as not to cross extensions of the protrusions. ### Claim 5 (depends on 1) The circuit substrate according to claim 1, wherein: the circuit substrate includes a central area and a peripheral area disposed around the central area, and the first mounting land is disposed in the peripheral area of the circuit substrate and the second mounting land is disposed in the central area of the circuit substrate. ### Claim 6 (depends on 1) The circuit substrate according to claim 1, wherein the protruding portion includes a plurality of tongue portions, each of the tongue portions extending from the outer side of the first mounting land toward the inner side of the first mounting land. ### Claim 7 (depends on 6) The circuit substrate according to claim 6, wherein one of the plurality of tongue portions is greater in length than another one of the plurality of the tongue portions. ### Claim 8 (depends on 7) The circuit substrate according to claim 7, wherein the protruding portion has a substantially quadrangular periphery and each tongue portion extends diagonally from a corner of the periphery toward the inner side of the first mounting land. ### Claim 9 (depends on 7) The circuit substrate according to claim 7, wherein the protruding portion has a substantially quadrangular periphery and the plurality of tongue portions include a first tongue portion extends diagonally from a corner of the periphery toward the inner side of the first mounting land and a second tongue portion extending from a side of the periphery toward the inner side of the first mounting land. ### Claim 10 (depends on 9) The circuit substrate according to claim 9, wherein a length of the first tongue portion is greater than a length of the second tongue portion. ### Claim 11 An electronic device having a circuit substrate on which an electronic component is mounted, the circuit substrate comprising a first mounting land configured to be connected to a mounting terminal of the electronic component by soldering and a second mounting land configured to be connected to a signal terminal of the electronic component by soldering, wherein the first mounting land has a larger area than the second mounting land so as to increase reliability of connection between the circuit substrate and the electronic component, wherein the first mounting land is provided with a protruding portion of an insulating material formed so as to protrude from an outer side of the first mounting land toward an inner the of the first mounting land, wherein the protruding portion does not divide the first mounting land into a plurality of areas, and wherein the second mounting land is not provided with the protruding portion. ### Claim 12 (depends on 11) The electronic device according to claim 11, wherein the insulating material is a solder resist provided on surface wiring of the circuit substrate. ### Claim 13 (depends on 11) The electronic device according to claim 11, wherein the protruding portion is formed so as to protrude toward substantially a center of the first mounting land. ### Claim 14 (depends on 11) The electronic device according to claim 11, wherein: the circuit substrate includes a central area and a peripheral area disposed around the central area, and the first mounting land is disposed in the peripheral area of the circuit substrate and the second mounting land is disposed in the central area of the circuit substrate. ### Claim 15 (depends on 11) The electronic device according to claim 11, wherein the protruding portion includes a plurality of tongue portions, each of the tongue portions extending from the outer side of the first mounting land toward the inner side of the first mounting land. ### Claim 16 (depends on 15) The electronic device according to claim 15, wherein one of the plurality of tongue portions is greater in length than another one of the plurality of the tongue portions. ### Claim 17 (depends on 16) The electronic device according to claim 16, wherein the protruding portion has a substantially quadrangular periphery and each tongue portion extends diagonally from a corner of the periphery toward the inner side of the first mounting land. ### Claim 18 (depends on 16) The electronic device according to claim 16, wherein the protruding portion has a substantially quadrangular periphery and the plurality of tongue portions include a first tongue portion extends diagonally from a corner of the periphery toward the inner side of the first mounting land and a second tongue portion extending from a side of the periphery toward the inner side of the first mounting land. ### Claim 19 (depends on 18) The electronic device according to claim 18, wherein a length of the first tongue portion is greater than a length of the second tongue portion.