# US 9,521,747 B2 · Connection board, optoelectronic component arrangement and illumination device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,521,747 B2 - Document ID: US9521747B2 - Status: Granted - Kind: B2 - Application number: 14/363,823 - Filed: 2012-12-14 - Published: 2014-11-27 - Granted: 2016-12-13 - Earliest claimed: 2011-12-22 - Assignees: OSRAM Opto Semiconductors GmbH - Applicants: OSRAM Opto Semiconductors GmbH - Inventors: Michael Rasp; Konrad Wagner - Web page: https://patentgrep.com/patent/US9521747B2 ## CPC - H05K 1/0296: {Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18)} - F21V 19/0005: {of sources having contact pins, wires or blades, e.g. pinch sealed lamp (F21V19/001 takes precedence)} - H05K 1/0268: {for electrical inspection or testing} - H05K 1/05: Insulated {conductive substrates, e.g. insulated} metal substrate - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)} - F21V 19/003: {Fastening of light source holders, e.g. of circuit boards or substrates holding light sources} - F21Y 2115/10: Light-emitting diodes [LED] - H05K 2201/09463: Partial lands, i.e. lands or conductive rings not completely surrounding the hole - H05K 2201/0949: Pad close to a hole, not surrounding the hole - H05K 2201/09663: Divided layout, i.e. conductors divided in two or more parts - H05K 2201/10106: Light emitting diode [LED] - H05K 2201/10409: Screws - H05K 2201/10886: Other details - H05K 2203/162: Testing a finished product, e.g. heat cycle testing of solder joints - H05K 2203/173: Adding connections between adjacent pads or conductors, e.g. for modifying or repairing - H10W 72/884: {Die-attach connectors and bond wires} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A connection board includes at least one cut-out to fasten the connection board to an installation board and multiple contact surfaces electrically isolated from one another, wherein the contact surfaces electrically connect to one another when the connection board is in a fastened state by a fastener that extends through the cut-out. ## Claims ### Claim 1 An optoelectronic component arrangement comprising: a connection board comprising a first contact surface, a second contact surface electrically isolated from the first contact surface, and at least one cut-out to fasten the connection board to an installation board and multiple contact surfaces electrically isolated from one another, wherein the first contact surface and the second contact surface electrically connect to one another when the connection board is in the fastened state by a fastener that extends through the cut-out, a first component that generates radiation and electrically conductively connects to the first contact surface, and a second component that generates radiation and electrically conductively connects to the second contact surface, wherein the first contact surface and the second contact surface electrically connect to one another when the connection board is in a fastened state on the installation board, the first component and the second component comprise at least one luminescent diode chip, and the fastener non-positively connects with the installation board. ### Claim 2 (depends on 1) The optoelectronic component arrangement according to claim 1, wherein the connection board is a circuit board. ### Claim 3 (depends on 2) The optoelectronic component arrangement according to claim 2, wherein the circuit board comprises a metal body and an insulation layer arranged on the metal body. ### Claim 4 (depends on 1) The optoelectronic component arrangement according to claim 1, wherein the first contact surface and the second contact surface are arranged on a front face of the connection board and a rear face of the connection board is provided for fastening to the installation board, said rear face lying opposite the front face. ### Claim 5 (depends on 1) The optoelectronic component arrangement according to claim 1, wherein first contact surface and the second contact surface extend around the cut-out in sections in a ring shape segment. ### Claim 6 (depends on 1) The component arrangement according to claim 1, wherein the first component and the second component electrically conductively connect to a common counter contact. ### Claim 7 (depends on 6) The component arrangement according to claim 6, wherein: the connection board comprises a metal body and an insulation layer arranged on the metal body; the metal body forms the common counter contact; and the first contact surface and the second contact surface are arranged on a side of the insulation layer, said side being remote from the metal body. ### Claim 8 (depends on 1) The component arrangement according to claim 1, wherein the first component and the second component are electrically contactable independently from one another prior to being fastened to the installation board. ### Claim 9 (depends on 1) The component arrangement according to claim 1, wherein the first component and the second component electrically connect parallel to one another. ### Claim 10 (depends on 1) The component arrangement according to claim 1, wherein the first component and the second component are bare semiconductor chips. ### Claim 11 (depends on 1) An illumination device having at least one component arrangement according to claim 1 and having an installation board on which the component arrangement is fastened by at least one fastener such that the first contact surface and the second contact surface electrically connect to one another. ### Claim 12 (depends on 11) The illumination device according to claim 11, wherein: the connection board comprises a cut-out and a further cut-out; the connection board comprises at least a third contact surface electrically conductively connected to a third component; the connection board is fastened to the installation board by a further fastener, so that the first contact surface electrically conductively connects to the third contact surface by way of the first fastener, the installation board and the further fastener. ### Claim 13 (depends on 11) The illumination device according to claim 11, wherein a sleeve that electrically insulates the fastener from the connection board is arranged in the cut-out. ### Claim 14 An optoelectronic component arrangement comprising: a connection board comprising a first contact surface and a second contact surface electrically isolated from the first contact surface, a first component that generates radiation and electrically conductively connects to the first contact surface, and a second component that generates radiation and electrically conductively connects to the second contact surface, wherein the first component and the second component are luminescence diode chips, the first component and the second component are electrically contactable independently from one another prior to being fastened to the installation board, the first component and the second component electrically connect in parallel to one another via the first contact surface and the second contact surface when the connection board is in a fastened state on an installation board. ### Claim 15 (depends on 14) The optoelectronic component arrangement according to claim 14, wherein the first contact surface and the second contact surface directly connect to one another via a fastener extending through the cut-out or via a contact element pressed against the first contact surface and the second contact surface by the fastener. ### Claim 16 (depends on 14) The component arrangement according to claim 14, wherein the first component and the second component electrically conductively connect to a common counter contact. ### Claim 17 An optoelectronic component arrangement comprising: a connection board comprising a first contact surface and a second contact surface electrically isolated from the first contact surface, a first component that generates radiation and electrically conductively connects to the first contact surface, and a second component that generates radiation and electrically conductively connects to the second contact surface, wherein the first contact surface and the second contact surface electrically connect to one another when the connection board is in a fastened state on an installation board; the first component and the second component electrically conductively connect to a common counter contact; the connection board comprises a metal body and an insulation layer arranged on the metal body; the metal body forms the common counter contact; and the first contact surface and the second contact surface are arranged on a side of the insulation layer, said side being remote from the metal body. ### Claim 18 (depends on 17) The optoelectronic component arrangement according to claim 17, further comprising at least one opening formed in the connection board in a region of the connection board in which the metal body is not covered by the insulation layer so that the metal body is externally electrically contactable via a fastener extending through the opening. ### Claim 19 An optoelectronic component arrangement comprising: a circuit board comprising a first contact surface and a second contact surface electrically isolated from the first contact surface, a first component that generates radiation and electrically conductively connects to the first contact surface, and a second component that generates radiation and electrically conductively connects to the second contact surface, wherein the first contact surface and the second contact surface electrically connect to one another when the circuit board is in a fastened state on an installation board, and the first component and the second component comprise at least one luminescent diode chip, wherein the circuit board comprises a metal body and an insulation layer arranged on the metal body. ### Claim 20 An optoelectronic component arrangement comprising: a connection board comprising a first contact surface and a second contact surface electrically isolated from the first contact surface, a first component that generates radiation and electrically conductively connects to the first contact surface, and a second component that generates radiation and electrically conductively connects to the second contact surface, wherein the first contact surface and the second contact surface electrically connect to one another when the connection board is in a fastened state on an installation board, the first component and the second component comprise at least one luminescent diode chip, and the first component and the second component electrically conductively connect to a common counter contact.