# US 9,521,743 B2 · Printed circuit board with crosstalk reduction features

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- Number: US 9,521,743 B2
- Document ID: US9521743B2
- Status: Granted
- Kind: B2
- Application number: 14/653,222
- Filed: 2013-12-12
- Published: 2015-12-17
- Granted: 2016-12-13
- Earliest claimed: 2012-12-21
- Assignees: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Applicants: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Inventors: Martin Fischeneder; Mikael Tuominen
- Web page: https://patentgrep.com/patent/US9521743B2

## CPC

- H05K 1/0218: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)}
- H05K 1/0298: {Multilayer circuits}
- H05K 1/0366: {reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence)}
- H05K 1/092: {Dispersed materials, e.g. conductive pastes or inks}
- H05K 3/1216: {by screen printing or stencil printing}
- H05K 2201/0723: provided by an inner layer of PCB
- H05K 2203/013: Inkjet printing, e.g. for printing insulating material or resist
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A printed circuit board comprising conductive layers separated by insulation layers of dielectric material, at least one conductive layer being patterned and having at least one signal line embedded in insulation material. The at least one signal line is covered by a dielectric film, followed by a thin conductive layer, whereby the dielectric film covers at least one surface and both sides of the at least one signal line and the thin conductive layer extends, separated by the dielectric film, over the at least one surface of the signal line and at least partially over the height of both sides of the signal line.

## Claims

### Claim 1

A printed circuit board comprising conductive layers separated by insulation layers of dielectric material, at least one conductive layer being patterned and having one signal line embedded in insulation material, characterized in that at least two signal lines are embedded in insulation material and covered by a dielectric film, followed by a conductive layer, whereby the dielectric film covers at least one surface and both sides of the at least two signal lines and the conductive layer extends, separated by the dielectric film, over the at least one surface of the at least two signal lines and at least partially along the height of both sides of the signal lines, and that it comprises at least a support core layer, a structured first conductive layer including the at least two signal lines with the dielectric film and the conductive layer arranged on the support core layer, followed by a first prepreg-layer, and a second conductive layer, comprising a signal line.

### Claim 2 (depends on 1)

A printed circuit board according to claim 1, characterized in that the dielectric film is an epoxy film.

### Claim 3 (depends on 2)

A printed circuit board according to claim 2, characterized in that the dielectric film is a screen printed film.

### Claim 4 (depends on 2)

A printed circuit board according to claim 2, characterized in that the dielectric film is a laminated film.

### Claim 5 (depends on 2)

A printed circuit board according to claim 2, characterized in that the dielectric film is an ink jetted film.

### Claim 6 (depends on 5)

A printed circuit board according to claim 5, characterized in that the conductive layer is made of carbon paste.

### Claim 7 (depends on 5)

A printed circuit board according to claim 5, characterized in that the conductive layer is made of silver paste.

### Claim 8 (depends on 5)

A printed circuit board according to claim 5, characterized in that the conductive layer is made of copper paste.

### Claim 9 (depends on 8)

A printed circuit board according to claim 8, characterized in that the second conductive layer is followed by a second prepreg-layer and a third conductive layer.