# US 9,521,739 B2 · Printed circuit board and design method thereof

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- Number: US 9,521,739 B2
- Document ID: US9521739B2
- Status: Granted
- Kind: B2
- Application number: 14/394,477
- Filed: 2014-08-27
- Published: 2016-02-18
- Granted: 2016-12-13
- Earliest claimed: 2014-08-08
- Assignees: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Applicants: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Inventors: Jianyong Fu
- Web page: https://patentgrep.com/patent/US9521739B2

## CPC

- H05K 1/0215: {Grounding of printed circuits by connection to external grounding means}
- H01R 4/34: Conductive members located under head of screw
- H05K 1/0216: {Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215)}
- H01R 4/64: Connections between or with conductive parts having primarily a non-electric function, e.g. frame, casing, rail
- H01R 12/51: for rigid printed circuits or like structures
- H05K 3/0005: {for designing circuits by computer}
- H05K 3/3452: Solder masks
- H05K 2201/10409: Screws
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS

## Abstract

A printed circuit board (PCB) is provided. From top to bottom, the PCB sequentially includes: a top layer; an upper solder resist layer; a wiring layer; a lower solder resist layer; a bottom layer; and a hole installation part disposed on the upper solder resist layer, the wiring layer, the lower solder resist layer, and the bottom layer. Wherein, the hole installation part includes a screw hole and a copper exposing region; a copper foil is disposed on the copper exposing region of the upper solder resist layer, the wiring layer, the lower solder resist layer, and the bottom layer; an area of the copper foil is not less than an area of the copper exposing region.

## Claims

### Claim 1

A printed circuit board (PCB), from a top to a bottom, sequentially comprising:
a top layer;
an upper solder resist layer;
a wiring layer;
a lower solder resist layer;
a bottom layer; and
a hole installation part disposed on each of the top layer, the upper solder resist layer, the wiring layer, the lower solder resist layer, and the bottom layer;
wherein, the hole installation part includes a screw hole and a copper exposing region; a copper foil is disposed on the copper exposing region of each of the top layer, the upper solder resist layer, the wiring layer, the lower solder resist layer, and the bottom layer; an area of the copper foil is not less than an area of the copper exposing region; and
wherein, the copper foil is disposed on a surface of each of the top layer, the upper solder resist layer, the wiring layer, the lower solder resist layer, and the bottom layer, and the copper foil does not disposed at an inner side wall of each of the top layer, the upper solder resist layer, the wiring layer, the lower solder resist layer, and the bottom layer.

### Claim 2 (depends on 1)

The PCB according to claim 1, wherein, the area of the copper foil is equal to the area of the copper exposing region.

### Claim 3 (depends on 1)

The PCB according to claim 1, wherein, a diameter of the copper exposing region is greater than a diameter of the screw hole by at least 0.2 mm.