# US 9,521,738 B1 · Graphite sheet to protect SMT components from thermal exposure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,521,738 B1 - Document ID: US9521738B1 - Status: Granted - Kind: B1 - Application number: 14/560,898 - Filed: 2014-12-04 - Granted: 2016-12-13 - Earliest claimed: 2013-12-23 - Assignees: Flextronics AP, LLC - Applicants: Flextronics AP, LLC - Inventors: Dennis Willie; Richard Loi; David Geiger; Anwar Mohammed; Murad Kurwa; Hector Rene Marin Hernandez - Web page: https://patentgrep.com/patent/US9521738B1 ## CPC - H05K 1/0201: {Thermal arrangements, e.g. for cooling, heating or preventing overheating} - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - H05K 1/0204: {using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence)} - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 1/181: associated with surface mounted components - H05K 3/3494: Heating processes for reflow soldering - H05K 7/20209: {Thermal management, e.g. fan control} - H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)} - H10W 40/25: characterised by their materials - H05K 2201/0323: Carbon - H05K 2201/06: Thermal details - H05K 2201/062: Means for thermal insulation, e.g. for protection of parts - H05K 2201/10371: Shields or metal cases - H05K 2203/304: Protecting a component during manufacturing - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A formed graphite sheet is shaped and sized as a protective shield positioned over an electronic component coupled to a PCB. The formed graphite sheet is used to protect a body of the electronic component from heat applied during the assembly of the electronic component to the PCB, such as the heating steps used in SMT and through-hole technology. ## Claims ### Claim 1 A heat shielding system comprising: a. a substrate having a first surface; b. an electronic component having a body and one or more electronic leads extending from the body, wherein the electronic component is coupled to the substrate; and c. a formed graphite sheet positioned over the electronic component and coupled to the first surface of the substrate, wherein the formed graphite sheet is configured to enable a temperature gradient between the body of the electronic component and the one or more electronic leads when external heat is applied to the system, wherein the temperature gradient is enabled such that an electronic lead temperature is at least a first threshold temperature while a body temperature is maintained below a second threshold temperature where the second threshold temperature is less than the first threshold temperature. ### Claim 2 (depends on 1) The heat shielding system of claim 1 wherein the substrate comprises a printed circuit board. ### Claim 3 (depends on 2) The heat shielding system of claim 2 wherein the electronic component is coupled to the printed circuit board using surface mount technology. ### Claim 4 (depends on 2) The heat shielding system of claim 2 wherein the electronic component is coupled to the printed circuit board using through-hole technology. ### Claim 5 (depends on 1) The heat shielding system of claim 1 wherein the one or more electronic leads are soldered to the substrate, and the first threshold temperature is a temperature sufficient to melt solder. ### Claim 6 (depends on 5) The heat shielding system of claim 5 wherein the second threshold temperature is a temperature sufficient to damage the body of the electronic component. ### Claim 7 (depends on 1) The heat shielding system of claim 1 wherein the formed graphite sheet comprises a graphite cap. ### Claim 8 (depends on 1) The heat shielding system of claim 1 wherein the formed graphite sheet comprises a top surface configured to cover the electronic component and a bottom surface surrounding an opening through which the electronic component fits. ### Claim 9 (depends on 8) The heat shielding system of claim 8 wherein the bottom surface of the formed graphite sheet is positioned against the first surface of the substrate such that the electronic component fits within the formed graphite sheet. ### Claim 10 (depends on 9) The heat shielding system of claim 9 wherein the electronic component is coupled to the printed circuit board using through-hole technology. ### Claim 11 (depends on 8) The heat shielding system of claim 8 wherein the formed graphite sheet further comprises a plurality of standoffs coupled to the bottom surface, further wherein the plurality of standoffs are positioned against the first surface of the substrate such that the body of the electronic component fits within the formed graphite sheet and there is a separation between the bottom surface of the formed graphite sheet and the first surface of the substrate. ### Claim 12 (depends on 11) The heat shielding system of claim 11 wherein the electronic component is coupled to the printed circuit board using surface mount technology. ### Claim 13 (depends on 8) The heat shielding system of claim 8 wherein the bottom surface forms an uninterrupted perimeter around the opening. ### Claim 14 (depends on 8) The heat shielding system of claim 8 wherein the formed graphite sheet further comprises one or more cut outs formed in the bottom surface such that within each cut out there is a separation between the formed graphite sheet and the first surface of the substrate. ### Claim 15 A heat shielding system comprising: a. a printed circuit board having a first surface; b. an electronic component having a body and one or more electronic leads extending from the body, wherein the electronic component is mounted to the first surface of the printed circuit board; and c. a graphite cap positioned over the electronic component and coupled to the first surface of the printed circuit board, wherein the graphite cap comprises a top surface configured to cover the electronic component and a bottom surface surrounding an opening through which the electronic component fits, further wherein the graphite cap is configured to enable a temperature gradient between the body of the electronic component and the one or more electronic leads when external heat is applied to the system such that an electronic lead temperature is at least a first threshold temperature while a body temperature is maintained below a second threshold temperature where the second threshold temperature is less than the first threshold temperature. ### Claim 16 (depends on 15) The heat shielding system of claim 15 wherein the one or more electronic leads are soldered to the printed circuit board, and the first threshold temperature is a temperature sufficient to melt solder. ### Claim 17 (depends on 16) The heat shielding system of claim 16 wherein the second threshold temperature is a temperature sufficient to damage the body of the electronic component. ### Claim 18 (depends on 15) The heat shielding system of claim 15 wherein the bottom surface of the graphite cap is positioned against the first surface of the printed circuit board such that the electronic component fits within the graphite cap. ### Claim 19 (depends on 18) The heat shielding system of claim 18 wherein the electronic component is coupled to the printed circuit board using through-hole technology. ### Claim 20 (depends on 15) The heat shielding system of claim 15 wherein the graphite cap further comprises a plurality of standoffs coupled to the bottom surface, further wherein the plurality of standoffs are positioned against the first surface of the printed circuit board such that the body of the electronic component fits within the graphite cap and there is a separation between the bottom surface of the graphite cap and the first surface of the printed circuit board. ### Claim 21 (depends on 20) The heat shielding system of claim 20 wherein the electronic component is coupled to the printed circuit board using surface mount technology. ### Claim 22 (depends on 15) The heat shielding system of claim 15 wherein the bottom surface forms an uninterrupted perimeter around the opening. ### Claim 23 (depends on 15) The heat shielding system of claim 15 wherein the graphite cap further comprises one or more cut outs formed in the bottom surface such that within each cut out there is a separation between the graphite cap and the first surface of the printed circuit board.