# US 9,520,852 B2 · Multilayer chip electronic component and board having the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,520,852 B2 - Document ID: US9520852B2 - Status: Granted - Kind: B2 - Application number: 14/456,857 - Filed: 2014-08-11 - Published: 2015-11-12 - Granted: 2016-12-13 - Earliest claimed: 2014-05-08 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Min Cheol Park; Sang Soo Park - Web page: https://patentgrep.com/patent/US9520852B2 ## CPC - H03H 7/0115: {comprising only inductors and capacitors (H03H7/075, H03H7/09, H03H7/12, H03H7/13 take precedence)} - H01F 17/0013: {with stacked layers} - H01F 27/292: {Surface mounted devices} - H01F 37/00: Fixed inductances not covered by group H01F17/00 - H01F 37/005: {without magnetic core} - H01G 2/065: {for surface mounting, e.g. chip capacitors} - H01G 4/008: Selection of materials - H01G 4/018: Dielectrics - H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)} - H01G 4/1227: {based on alkaline earth titanates} - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H01G 4/40: Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations - H03H 7/01: Frequency selective two-port networks - H01G 2/06: specially adapted for mounting on a printed-circuit support - H01G 4/0085: {Fried electrodes} - H01G 4/012: Form of non-self-supporting electrodes - H03H 2001/0085: {Multilayer, e.g. LTCC, HTCC, green sheets} - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) ## Abstract A multilayer chip electronic component may include: a ceramic body including a plurality of dielectric layers; an inductor part disposed within the ceramic body; a capacitor part disposed within the ceramic body; a first dummy electrode disposed within the ceramic body and a second dummy electrode disposed within the ceramic body; and first to sixth external electrodes disposed on first and second main surfaces of the ceramic body, a first connection terminal disposed on the second main surface and first end surface of the ceramic body, and a second connection terminal disposed on the second main surface and second end surface of the ceramic body. The inductor part may include first and second inductor parts, and the inductor part and the capacitor part are connected to each other. ## Claims ### Claim 1 A multilayer chip electronic component comprising: a ceramic body including a plurality of dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other; an inductor part disposed within the ceramic body and including first and fourth internal electrodes exposed to the first and second main surfaces and second and third internal electrodes exposed to the first main surface; a capacitor part disposed within the ceramic body and including a fifth internal electrode exposed to the first main surface and a sixth internal electrode exposed to the second main surface; a first connecting electrode disposed within the ceramic body and exposed to the second main surface and the first end surface of the ceramic body and a second connecting electrode disposed within the ceramic body and exposed to the second main surface and the second end surface of the ceramic body; and first to sixth external electrodes disposed on the first and second main surfaces of the ceramic body and electrically connected to the first to sixth internal electrodes, a first connection terminal disposed on the second main surface and the first end surface of the ceramic body and connected to the first connecting electrode, and a second connection terminal disposed on the second main surface and the second end surface of the ceramic body and connected to the second connecting electrode, wherein the inductor part is composed of first and second inductor parts, and the inductor part and the capacitor part are connected to each other. ### Claim 2 (depends on 1) The multilayer chip electronic component of claim 1, wherein the first internal electrode is connected to the second and fifth external electrodes, the second internal electrode is connected to the fifth and sixth external electrodes, the third internal electrode is connected to the fourth and sixth external electrodes, and the fourth internal electrode is connected to the first and fourth external electrodes. ### Claim 3 (depends on 1) The multilayer chip electronic component of claim 1, wherein the fifth internal electrode is connected to the sixth external electrode, and the sixth internal electrode is connected to the third external electrode. ### Claim 4 (depends on 1) The multilayer chip electronic component of claim 1, wherein the second and third internal electrodes and the fifth internal electrode are connected to each other through the sixth external electrode, such that the inductor part and the capacitor part are connected to each other. ### Claim 5 (depends on 1) The multilayer chip electronic component of claim 1, wherein the first and second connection terminals are formed of a plating layer. ### Claim 6 (depends on 1) A board having a multilayer chip electronic component, comprising: a printed circuit board having first to third electrode pads disposed thereon; and the multilayer chip electronic component of claim 1 mounted on the printed circuit board. ### Claim 7 A multilayer chip electronic component comprising: a ceramic body including a plurality of dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other; an inductor part disposed within the ceramic body and including first and fourth internal electrodes exposed to the first and second main surfaces and second and third internal electrodes exposed to the first main surface; a capacitor part disposed within the ceramic body and including two fifth internal electrodes exposed to the second main surface and a sixth internal electrode exposed to the second main surface; a first connecting electrode disposed within the ceramic body and exposed to the second main surface and the first end surface of the ceramic body and a second connecting electrode disposed within the ceramic body and exposed to the second main surface and the second end surface of the ceramic body; and first to sixth external electrodes disposed on the first and second main surfaces of the ceramic body and electrically connected to the first to sixth internal electrodes, a first connection terminal disposed on the second main surface and the first end surface of the ceramic body and connected to the first connecting electrode, and a second connection terminal disposed on the second main surface and the second end surface of the ceramic body and connected to the second connecting electrode, wherein the capacitor part is composed of first and second capacitor parts, and the inductor part and the capacitor part are connected to each other. ### Claim 8 (depends on 7) The multilayer chip electronic component of claim 7, wherein the two fifth internal electrodes are separately disposed on individual dielectric layers of the plurality of dielectric layers. ### Claim 9 (depends on 7) The multilayer chip electronic component of claim 7, wherein the first internal electrode is connected to the second and fifth external electrodes, the second internal electrode is connected to the fifth and sixth external electrodes, the third internal electrode is connected to the fourth and sixth external electrodes, and the fourth internal electrode is connected to the first and fourth external electrodes. ### Claim 10 (depends on 7) The multilayer chip electronic component of claim 7, wherein the two fifth internal electrodes are connected to the first and second external electrodes, respectively, and the sixth internal electrode is connected to the third external electrode. ### Claim 11 (depends on 7) The multilayer chip electronic component of claim 7, wherein the first and fourth internal electrodes and the two fifth internal electrodes are connected to each other through the first and second external electrodes, such that the inductor part and the capacitor part are connected to each other. ### Claim 12 (depends on 7) The multilayer chip electronic component of claim 7, wherein the first and second connection terminals are formed of a plating layer. ### Claim 13 (depends on 7) The multilayer chip electronic component of claim 7, wherein the two fifth internal electrodes are disposed on a single dielectric layer of the plurality of dielectric layers to be insulated from each other. ### Claim 14 (depends on 7) A board having a multilayer chip electronic component, comprising: a printed circuit board having first to third electrode pads disposed thereon; and the multilayer chip electronic component of claim 7 mounted on the printed circuit board.