# US 9,520,814 B2 · Bonding method, mounting table and substrate processing apparatus

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 9,520,814 B2
- Document ID: US9520814B2
- Status: Granted
- Kind: B2
- Application number: 14/158,916
- Filed: 2014-01-20
- Published: 2014-07-24
- Granted: 2016-12-13
- Earliest claimed: 2013-01-21
- Assignees: Tokyo Electron Limited
- Applicants: Tokyo Electron Limited
- Inventors: Daisuke Hayashi
- Web page: https://patentgrep.com/patent/US9520814B2

## CPC

- H02N 13/00: Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
- H02N: ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR

## Abstract

A distance between the surface of the base member and the electrostatic chuck having the heater pattern formed on a bottom surface thereof can be uniformized. A bonding method of bonding an electrostatic chuck and a base member to each other includes forming a filling member 30 by covering irregularities of a heater pattern 9a formed on a bottom surface 61 of the electrostatic chuck 9 facing the base member 10; grinding a base member contact surface 62 of the filling member 30 facing the base member 10; and bonding the ground base member contact surface 62 of the filling member 30 to the base member 10 with an adhesive layer 31 provided therebetween.

## Claims

### Claim 1

A mounting table, comprising:
a base member having a peripheral protruding portion formed at a periphery of the base member such that the peripheral protruding portion is higher than a central portion of the base member;
an electrostatic chuck provided on the central portion of the base member;
a heater pattern formed on a bottom surface of the electrostatic chuck facing the base member;
a filling member that covers irregularities of the heater pattern and has a ground base member contact surface facing the base member;
an adhesive layer that bonds the base member contact surface of the filling member and the base member to each other; and
a sealing member provided at an outer peripheral portion of the filling member and the adhesive layer, and is in contact with a side surface of the peripheral protruding portion of the base member.

### Claim 2

A bonding method of bonding an electrostatic chuck and a base member to each other, the bonding method comprising:
forming a filling member by covering irregularities of a heater pattern formed on a bottom surface of the electrostatic chuck facing the base member;
grinding a base member contact surface of the filling member facing the base member; and
bonding the ground base member contact surface of the filling member to the base member with an adhesive layer provided therebetween,
wherein the base member has a peripheral protruding portion formed at a periphery of the base member such that the peripheral protruding portion is higher than a central portion of the base member on which the electrostatic chuck is provided, and
a sealing member is provided at an outer peripheral portion of the filling member and the adhesive layer, and is in contact with a side surface of the peripheral protruding portion of the base member.

### Claim 3 (depends on 2)

The bonding method of claim 2, wherein the filling member has thermal conductivity ranging from about 0.2 W/mK to about 30 W/mK and breakdown voltage ranging from about 5 kV/mm to about 20 kV/mm.

### Claim 4 (depends on 2)

The bonding method of claim 2, wherein the adhesive layer has a sheet shape.

### Claim 5 (depends on 2)

The bonding method of claim 2, wherein the filling member is formed by spraying a mixture of resin and ceramic particles onto the bottom surface of the electrostatic chuck, and, then, sintering the sprayed mixture.

### Claim 6 (depends on 2)

The bonding method of claim 2, wherein the sealing member is an O-ring.

### Claim 7 (depends on 2)

The bonding method of claim 2, wherein the adhesive layer includes a first adhesive layer, a stress relaxing layer and a second adhesive layer stacked on top of each other, such that the stress relaxing layer is disposed between the first adhesive layer and the second adhesive layer.

### Claim 8

A substrate processing apparatus, comprising:
a mounting table including:
a base member having a peripheral protruding portion formed at a periphery of the base member such that the peripheral protruding portion is higher than a central portion of the base member;
an electrostatic chuck provided on the central portion of the base member;
a heater pattern formed on a bottom surface of the electrostatic chuck facing the base member;
a filling member that covers irregularities of the heater pattern and has a ground base member contact surface facing the base member;
an adhesive layer that bonds the base member contact surface of the filling member and the base member to each other; and
a sealing member provided at an outer peripheral portion of the filling member and the adhesive layer, and is in contact with a side surface of the peripheral protruding portion of the base member.