# US 9,520,812 B2 · Electronic device, electronic apparatus, and method of manufacturing electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,520,812 B2 - Document ID: US9520812B2 - Status: Granted - Kind: B2 - Application number: 13/905,316 - Filed: 2013-05-30 - Published: 2013-12-05 - Granted: 2016-12-13 - Earliest claimed: 2012-05-31 - Assignees: Seiko Epson Corporation - Applicants: Seiko Epson Corporation - Inventors: Yoshio Maeda - Web page: https://patentgrep.com/patent/US9520812B2 ## CPC - H02N 1/008: {Laterally driven motors, e.g. of the comb-drive type} - B81B 7/0074: {3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board} - B81B 7/02: containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence) - B81C 1/00293: {maintaining a controlled atmosphere with processes not provided for in B81C1/00285} - G01C 19/5719: using planar vibrating masses driven in a translation vibration along an axis - H05K 13/00: Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components - B81C 2201/019: Bonding or gluing multiple substrate layers - B81C 2203/051: Active alignment, e.g. using internal or external actuators, magnets, sensors, marks or marks detectors - Y10T 29/49002: Electrical device making - H02N: ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - G01C: MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY (measuring liquid level G01F; radio navigation, determining distance or velocity by use of propagation effects, e.g. Doppler effects, propagation time, of radio waves, analogous arrangements using other waves G01S) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract An electronic device includes a first base body, a second base body, a third base body held between the first base body and the second base body, a first functional element disposed in a first cavity surrounded by the first base body and the third base body, and a second functional element disposed in a second cavity surrounded by the second base body and the third base body. ## Claims ### Claim 1 An electronic device comprising: a first base body having first and second surfaces, a first recess and a first through hole, the first recess being provided in the first surface, the first through hole being formed between the first and second surfaces, a first through electrode being provided in the first through hole; a second base body having third and fourth surfaces, a second recess and a second through hole, the second recess being provided in the third surface, the second through hole being formed between the third and fourth surfaces, a second through electrode being provided in the second through hole; a third base body held between the first base body and the second base body, the third base body having fifth and sixth surfaces and third and fourth recesses, the third recess being provided in the fifth surface, the fourth recess being provided in the sixth surface; a first cavity formed by the first and third recesses; a second cavity formed by the second and fourth recesses; a first functional element disposed in the first cavity surrounded by the first base body and the third base body, the first functional element being a gyro sensor configured to detect an angular velocity, the first functional element including: a vibration member; a driving electrode; and a detection electrode; and a second functional element disposed in the second cavity surrounded by the second base body and the third base body, the second functional element being an acceleration sensor configured to detect acceleration, the second functional element including: a movable member; a movable electrode; a fixed member; and a fixed electrode, wherein the first through electrode is electrically connected to one of the driving electrode and the detection electrode, and the second through electrode is electrically connected to one of the movable electrode and the fixed electrode. ### Claim 2 (depends on 1) The electronic device according to claim 1, wherein the first base body and the second base body are each provided with an alignment mark. ### Claim 3 (depends on 2) An electronic apparatus comprising: the electronic device according to claim 2. ### Claim 4 (depends on 1) The electronic device according to claim 1, wherein the third base body has an opening section adapted to communicate the first cavity and the second cavity with each other. ### Claim 5 (depends on 4) An electronic apparatus comprising: the electronic device according to claim 4. ### Claim 6 (depends on 1) The electronic device according to claim 1, wherein a material of the first and second base bodies is glass, and a material of the third base body is one of silicon and glass. ### Claim 7 (depends on 6) An electronic apparatus comprising: the electronic device according to claim 6. ### Claim 8 (depends on 1) The electronic device according to claim 1, further comprising: a substrate, which includes an integrated circuit adapted to process signals of the first and second functional elements, and to which the first base body is mounted; and a mold section adapted to mold the first, second, and third base bodies and the substrate. ### Claim 9 (depends on 8) An electronic apparatus comprising: the electronic device according to claim 8. ### Claim 10 (depends on 1) An electronic apparatus comprising: the electronic device according to claim 1. ### Claim 11 A method of manufacturing an electronic device comprising: a first preparation step of preparing a first structure by preparing a first base body and then forming a first functional element on the first base body, the first base body has: first and second surfaces; a first recess; a first through hole; and a first through electrode, wherein the first recess is provided in the first surface, the first through hole is formed between the first and second surfaces, the first through electrode is provided in the first through hole; a second preparation step of preparing a second structure by preparing a second base body and then forming a second functional element on the second base body, the second base body has: third and fourth surfaces; a second recess; a second through hole; and a second throat electrode, wherein the second recess is provided in the third surface, the second through hole is formed between the third and fourth surfaces, the second through electrode is provided in the second through hole; a third preparation step of preparing a third base body, the third base body has: fifth and sixth surfaces; and third and fourth recesses, wherein the third recess is provided in the fifth surface, the fourth recess is provided in the sixth recess; and a stacking step of housing the first functional element in a first cavity, which is formed by the first and third recesses, surrounded by the first base body and the third base body, and housing the second functional element in a second cavity, which is formed by the second and fourth recesses, surrounded by the second base body and the third base body by stacking the first base body, the second base body, and the third base body on each other so that the third base body is held between the first base body and the second base body, wherein the first functional element is a gyro sensor configured to detect an angular velocity, the gyro sensor including: a vibration member; a driving electrode; and a detection electrode; and the second functional element is an acceleration sensor configured to detect acceleration, the acceleration sensor including: a movable member; a movable electrode; a fixed member; and a fixed electrode, wherein the first through electrode is electrically connected to one of the driving electrode and the detection electrode, and the second through electrode is electrically connected to one of the movable electrode and the fixed electrode. ### Claim 12 (depends on 11) The method of manufacturing an electronic device according to claim 11, wherein the stacking step includes a step of bonding the first base body and the third base body to each other in a first pressure atmosphere to thereby form the first cavity of the first pressure atmosphere, and a step of bonding the second base body and the third base body to each other in a second pressure atmosphere to thereby form the second cavity of the second pressure atmosphere, and the first pressure atmosphere and the second atmosphere are different in pressure from each other. ### Claim 13 (depends on 11) The method of manufacturing an electronic device according to claim 11, wherein the first preparation step further includes a step of forming at least one first alignment mark, the second preparation step further includes a step of forming at least one second alignment mark, the first alignment mark and the second alignment mark are simultaneously formed at the time of formation of the first functional element and the second functional element, respectively, and the stacking step further includes a step of performing alignment by visually detecting the first alignment mark and the second alignment mark. ### Claim 14 (depends on 11) The method of manufacturing an electronic device according to claim 11, wherein in the first preparation step, a first wafer having a plurality of the first structures in a first element region is prepared, in the second preparation step, a second wafer having a plurality of the second structures in a second element region is prepared, and in the third preparation step, a third wafer having a plurality of the third base bodies in a third element region is prepared, the method further comprising: a step of dicing the first wafer, the second wafer, and the third wafer stacked on each other into a plurality of electronic devices. ### Claim 15 (depends on 14) The method of manufacturing an electronic device according to claim 14, wherein the first alignment mark is formed outside the first element region of the first wafer, and the second alignment mark is formed outside the second element region of the second wafer.