# US 9,520,644 B2 · Antenna and communication apparatus as well as manufacturing method for antenna > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,520,644 B2 - Document ID: US9520644B2 - Status: Granted - Kind: B2 - Application number: 14/117,476 - Filed: 2011-08-04 - Published: 2014-11-13 - Granted: 2016-12-13 - Earliest claimed: 2011-05-13 - Assignees: Shuhou Co., Ltd. - Applicants: Kouji Muraoka - Inventors: Kouji Muraoka - Web page: https://patentgrep.com/patent/US9520644B2 ## CPC - H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)} - H01Q 1/243: {with built-in antennas} - H01Q 1/27: Adaptation for use in or on movable bodies (H01Q1/08, H01Q1/12, H01Q1/18 take precedence) - H01Q 1/36: Structural form of radiating elements, e.g. cone, spiral, umbrella; {Particular materials used therewith}(H01Q1/08, H01Q1/14 take precedence) - H01Q 1/364: {using a particular conducting material, e.g. superconductor} - H05K 3/18: using precipitation techniques to apply the conductive material - H05K 3/182: {characterised by the patterning method} - H05K 3/245: {Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques} - H05K 3/246: {Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating} - H05K 2201/0266: Size distribution - H05K 2203/0709: Catalytic ink or adhesive for electroless plating - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract This antenna (10) has an underlying print layer (2) which is upon the surface of a material (1) to be printed in a predetermined antenna pattern, and an electro-less plating layer (3) applied to the surface of the underlying print layer (2). The underlying print layer (2) is formed from an ink (2a) and a metallic powder (2b). A portion of the particles of the metallic powder (2b) are entrained within the ink layer in which the ink (2a) has been printed in a substantially uniform thickness. Some particles which are of large particle size project from the ink layer, and a portion of the ink (2a) covering the projecting portions is removed. ## Claims ### Claim 1 An antenna comprising: a base print layer printed in a predetermined antenna pattern on a workpiece, the base print layer being formed of an ink containing a plurality of metal particles having a predetermined particle diameter distribution; and an electroless plating layer disposed on a surface of the base print layer, wherein some of the metal particles are buried in an ink layer forming the base print layer, some of the metal particles are protrudent from the ink layer forming the base print layer, and part of the ink covering portions of the protrudent metal particles has been removed. ### Claim 2 (depends on 1) The antenna of claim 1, wherein the metal particles are contained in the ink with a proportion by volume of 30 to 70%. ### Claim 3 (depends on 1) The antenna of claim 1, wherein the electroless plating layer is formed of Cu, and an electroless Ni plating layer is disposed on a surface of the electroless Cu plating layer. ### Claim 4 (depends on 3) The antenna of claim 3, wherein an electroless Au plating layer is disposed on a surface of the electroless Ni plating layer. ### Claim 5 (depends on 1) The antenna of claim 1, wherein, the metal particles are any of Cu, Ni, Fe, Mg, Pd, Ag, Au and C, or an alloy of any of Cu, Ni, Fe, Mg, Pd, Ag and Au, and particle diameters of approximately 95% of the metal particles are distributed in the range from 0.04 to 50 and the particle diameters of approximately 40% of the metal particles are distributed in the range from 5 to 30 μm. ### Claim 6 (depends on 1) A communication device comprising the antenna of claim 1. ### Claim 7 (depends on 1) A method for manufacturing the antenna of claim 1 comprising: a printing step of forming the base print layer in a predetermined antenna pattern on a workpiece with the ink containing the plurality of metal particles having a predetermined particle diameter distribution; an ink removing step of removing, from those of the metal particles that are protrudent from ink layer forming the base print layer, part of the ink covering portions of the metal particles that are protrudent from the ink layer; and an electroless plating step of forming the electroless plating layer on a surface of the base print layer. ### Claim 8 (depends on 2) The antenna of claim 2, wherein the electroless plating layer is formed of Cu, and an electroless Ni plating layer is disposed on a surface of the electroless Cu plating layer. ### Claim 9 (depends on 5) The antenna of claim 5, wherein an electroless Au plating layer is disposed on a surface of the electroless Ni plating layer. ### Claim 10 (depends on 2) The antenna of claim 2, wherein, the metal particles are any of Cu, Ni, Fe, Mg, Pd, Ag, Au and C, or an alloy of any of Cu, Ni, Fe, Mg, Pd, Ag and Au, and particle diameters of approximately 95% of the metal particles are distributed in the range from 0.04 to 50 μm, and the particle diameters of approximately 40% of the metal particles are distributed in the range from 5 to 30 μm. ### Claim 11 (depends on 2) A communication device comprising the antenna of claim 2.