# US 9,520,643 B2 · Electronic device with foam antenna carrier

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- Number: US 9,520,643 B2
- Document ID: US9520643B2
- Status: Granted
- Kind: B2
- Application number: 13/860,437
- Filed: 2013-04-10
- Published: 2014-10-16
- Granted: 2016-12-13
- Earliest claimed: 2013-04-10
- Assignees: Apple Inc.
- Applicants: Apple Inc.
- Inventors: Boon W. Shiu; Chun-Lung Chen
- Web page: https://patentgrep.com/patent/US9520643B2

## CPC

- H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)}
- H01Q 1/243: {with built-in antennas}
- H01Q 9/0421: {with a shorting wall or a shorting pin at one end of the element (H01Q9/0414 takes precedence)}
- Y10T 29/49016: Antenna or wave energy "plumbing" making
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Electronic devices may include radio-frequency transceiver circuitry and antenna structures. The antenna structures may include a dielectric carrier such as a foam carrier. The foam carrier may be formed from a material that can withstand elevated temperatures. Metal traces for antennas can be formed on the foam carrier by selectively activating areas on a powder coating with a laser and plating the laser-activated areas. Metal for the antennas may also be formed by attaching layers such as flexible printed circuit layers and metal foil layers to the foam carrier. Solder may be used to attach a coaxial cable or other transmission line, electrical components, and other electrical structures to the metal antenna structures on the foam carrier. The foam carrier may be formed from open cell or closed cell foam. The surface of the foam may be smoothed to facilitate formation of metal antenna structures.

## Claims

### Claim 1

An antenna, comprising:
a foam carrier;
metal on the foam carrier;
a powder coating on the foam carrier, wherein the metal comprises metal traces on the powder coating;
solder on the metal; and
an additional powder coating formed on the metal traces such that the metal traces are interposed between the powder coating and the additional powder coating.

### Claim 2 (depends on 1)

The antenna defined in claim 1 wherein the foam carrier comprises open cell foam.

### Claim 3 (depends on 1)

The antenna defined in claim 1 wherein the foam carrier comprises closed cell foam.

### Claim 4 (depends on 1)

The antenna defined in claim 1 wherein the powder coating comprises laser-activated areas and wherein the metal traces comprises plated metal traces on the laser-activated areas.

### Claim 5

A method of forming an antenna, comprising:
depositing a powder on a foam carrier;
after depositing the powder on the foam carrier, exposing the deposited powder to a temperature of more than 150° C.;
after exposing the deposited powder to the temperature of more than 150° C., selectively exposing areas of the powder to laser light; and
plating metal onto the exposed areas following exposure of the areas to the laser light to form metal antenna traces on the foam carrier.

### Claim 6 (depends on 5)

The method defined in claim 5 further comprising:
soldering at least one component to the metal antenna traces using solder.

### Claim 7 (depends on 6)

The method defined in claim 6 wherein soldering the component comprises depositing solder paste and exposing the solder paste to a temperature of at least 200° C.

### Claim 8 (depends on 5)

The method defined in claim 5 further comprising:
before depositing the powder on the foam carrier, inserting a metal insert into the interior of the foam carrier to charge the foam carrier.

### Claim 9 (depends on 5)

The method defined in claim 5, wherein the powder comprises polymer particles and additional metal.

### Claim 10 (depends on 5)

The method defined in claim 5, wherein the powder comprises laser direct structuring powder.