# US 9,520,545 B2 · Light-emitting device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,520,545 B2 - Document ID: US9520545B2 - Status: Granted - Kind: B2 - Application number: 15/059,987 - Filed: 2016-03-03 - Published: 2016-06-30 - Granted: 2016-12-13 - Earliest claimed: 2008-12-31 - Assignees: Epistar Corporation - Applicants: Epistar Corporation - Inventors: Chia-Liang Hsu - Web page: https://patentgrep.com/patent/US9520545B2 ## CPC - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/819: characterised by their shape, e.g. curved or truncated substrates - H10H 20/83: Electrodes - H10H 20/831: characterised by their shape - H10H 20/8314: {extending at least partially onto an outer side surface of the bodies} - H10H 20/8506: {Containers} - H10H 20/825: containing nitrogen, e.g. GaN - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 72/0198: {batch processes} - H10W 72/073: {of die-attach connectors} - H10W 72/874: {On different surfaces} - H10W 90/00: Package configurations - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A light-emitting device is provided. The light-emitting device comprises: a supporting member having a top surface; a first conductive via and a second conductive via separated from the first conductive, wherein the first conductive via and the second conductive via each has only one through-hole in the supporting member; and a semiconductor structure on the top surface of the supporting member, wherein the semiconductor structure comprises a first conductive type semiconductor layer, a second conductive type semiconductor layer and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, wherein the semiconductor structure overlays the second conductive via; and a conductive layer on a sidewall of the semiconductor structure and electrically connecting the first conductive via to one of the semiconductor layers. ## Claims ### Claim 1 A light-emitting device, comprising: a supporting member having a top surface; a first conductive via and a second conductive via separated from the first conductive, wherein the first conductive via and the second conductive via each has only one through-hole in the supporting member; a semiconductor structure on the top surface of the supporting member, wherein the semiconductor structure comprises a first conductive type semiconductor layer, a second conductive type semiconductor layer and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, wherein the semiconductor structure overlays the second conductive via; a conductive layer on a sidewall of the semiconductor structure and electrically connecting the first conductive via to one of the semiconductor layers; and a conductive adhesive layer between the semiconductor structure and the second conductive via, wherein the conductive adhesive layer directly contacts the second conductive via and covers a top surface of the second conductive via. ### Claim 2 (depends on 1) The light-emitting device according to claim 1, further comprising an electrode and an insulation structure, wherein the electrode is on the semiconductor structure, and the insulation structure is between the electrode and the supporting member. ### Claim 3 (depends on 2) The light-emitting device according to claim 2, wherein the insulation structure is on the sidewall of the semiconductor structure and on a part of the supporting member that is between the first conductive via and the second conductive via. ### Claim 4 (depends on 2) The light-emitting device according to claim 2, wherein the insulation structure is between the semiconductor structure and the conductive layer. ### Claim 5 (depends on 2) The light-emitting device according to claim 2, further comprising a protecting layer overlaps the insulation structure. ### Claim 6 (depends on 1) The light-emitting device according to claim 1, further comprising an insulation structure between the semiconductor structure and the conductive layer. ### Claim 7 (depends on 1) The light-emitting device according to claim 1, wherein the supporting member comprises non-conductive material. ### Claim 8 (depends on 1) The light-emitting device according to claim 1, wherein the conductive layer covers a top surface of the first conductive via. ### Claim 9 (depends on 1) The light-emitting device according to claim 1, wherein a surface of the conductive layer is coplanar with a surface of the conductive adhesive layer. ### Claim 10 (depends on 1) The light-emitting device according to claim 1, wherein a transverse width of the conductive adhesive layer is the same as a transverse width of the semiconductor structure. ### Claim 11 (depends on 1) The light-emitting device according to claim 1, further comprising an electrode between the semiconductor structure and the conductive layer. ### Claim 12 (depends on 1) The light-emitting device according to claim 1, wherein the supporting member comprises flexible material. ### Claim 13 (depends on 1) The light-emitting device according to claim 1, wherein the supporting member has a thickness smaller than 200 μm. ### Claim 14 A light-emitting device, comprising: a supporting member having a top surface; a first conductive via and a second conductive via separated from the first conductive, wherein the first conductive via and the second conductive via each has only one through-hole in the supporting member; a semiconductor structure on the top surface of the supporting member, wherein the semiconductor structure comprises a first conductive type semiconductor layer, a second conductive type semiconductor layer and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, wherein the semiconductor structure overlays the second conductive via; and a conductive layer on a sidewall of the semiconductor structure and electrically connecting the first conductive via to one of the semiconductor layers, wherein the conductive layer extends on the semiconductor structure opposite to the second conductive via. ### Claim 15 (depends on 14) The light-emitting device according to claim 14, further comprising an insulation structure between the semiconductor structure and the conductive layer. ### Claim 16 A light-emitting device, comprising: a supporting member having a top surface; a first conductive via and a second conductive via separated from the first conductive, wherein the first conductive via and the second conductive via each has only one through-hole in the supporting member; a semiconductor structure on the top surface of the supporting member, wherein the semiconductor structure comprises a first conductive type semiconductor layer, a second conductive type semiconductor layer and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, wherein the semiconductor structure overlays the second conductive via; and a conductive layer on a sidewall of the semiconductor structure and electrically connecting the first conductive via to one of the semiconductor layers, wherein the top surface is with a first surface area, the first conductive via has a top surface with a second surface area, the second conductive via has a top surface with a third surface area, and the sum of the second surface area and the third surface area is greater than 40% of the first surface area and smaller than the first surface area. ### Claim 17 (depends on 16) The light-emitting device according to claim 16, further comprising an insulation structure between the semiconductor structure and the conductive layer. ### Claim 18 A light-emitting device, comprising: a supporting member having a top surface; a first conductive via and a second conductive via separated from the first conductive, wherein the first conductive via and the second conductive via each has only one through-hole in the supporting member; a semiconductor structure on the top surface of the supporting member, wherein the semiconductor structure comprises a first conductive type semiconductor layer, a second conductive type semiconductor layer and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, wherein the semiconductor structure overlays the second conductive via; and a conductive layer on a sidewall of the semiconductor structure and electrically connecting the first conductive via to one of the semiconductor layers, wherein the top surface is with a first surface area, and the active layer has a fourth surface area greater than 30% of the first surface area and smaller than the first surface area. ### Claim 19 (depends on 18) The light-emitting device according to claim 18, further comprising an insulation structure between the semiconductor structure and the conductive layer. ### Claim 20 A light-emitting device, comprising: a supporting member having a top surface; a first conductive via and a second conductive via separated from the first conductive, wherein the first conductive via and the second conductive via each has only one through-hole in the supporting member; a semiconductor structure on the top surface of the supporting member, wherein the semiconductor structure comprises a first conductive type semiconductor layer, a second conductive type semiconductor layer and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, wherein the semiconductor structure overlays the second conductive via; a conductive layer on a sidewall of the semiconductor structure and electrically connecting the first conductive via to one of the semiconductor layers; and a protection layer directly contacts the supporting member and the conductive layer.