# US 9,520,544 B2 · Light source including ceramic substrate mounted on mounting substrate

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- Number: US 9,520,544 B2
- Document ID: US9520544B2
- Status: Granted
- Kind: B2
- Application number: 14/869,499
- Filed: 2015-09-29
- Published: 2016-03-31
- Granted: 2016-12-13
- Earliest claimed: 2014-09-30
- Assignees: Nichia Corporation
- Applicants: Nichia Corporation
- Inventors: Takuji Hosotani
- Web page: https://patentgrep.com/patent/US9520544B2

## CPC

- H10H 20/8581: {characterised by their material}
- H10H 20/8506: {Containers}
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10W 90/00: Package configurations
- H10H 20/036: {of packages}
- H10H 20/0362: {of encapsulations}
- H10H 20/0364: {of interconnections}
- H10H 20/0365: {of means for heat extraction or cooling}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A light source includes a light emitting element configured to emit a light; a mounting substrate; and a ceramic substrate having a light emitting element mounted thereon and being bonded to the mounting substrate via a plurality of metal bumps made of gold, copper, a gold alloy, or a copper alloy. A method of manufacturing a light source includes forming a plurality of metal bumps on a mounting substrate; providing a ceramic substrate having at least one light emitting element mounted thereon; and bonding the mounting substrate and a ceramic substrate to each other via the metal bumps.

## Claims

### Claim 1

A light source comprising:
a light emitting element configured to emit a light;
a mounting substrate; and
a ceramic substrate having the light emitting element mounted thereon, the ceramic substrate being bonded to the mounting substrate via a plurality of metal bumps made of gold, copper, a gold alloy, or a copper alloy.

### Claim 2 (depends on 1)

The light source according to claim 1, further comprising a resin disposed in gaps between the plurality of metal bumps.

### Claim 3 (depends on 1)

The light source according to claim 1, wherein the mounting substrate comprises copper or a copper alloy.

### Claim 4 (depends on 2)

The light source according to claim 2, wherein the mounting substrate comprises copper or a copper alloy.